In this paper we report on the production of thin film transistors using a novel photo-enhanced chemical vapour deposition process. Both the active layer, amorphous silicon, and the gate dielectric, silicon dioxide, have been deposited using a windowless internal lamp deposition system, from silane and silane:nitrous oxide gas mixtures, respectively. Using this technique we eliminate some of the problems of conventional photo-CVD. We report on the material properties and the manufacture and characteristics of large scale (0.5 mm2) TFT test structures. For these structures we obtain a threshold voltage of 25 V and a field effect mobility of 0.07 cm2/V/s.