A transmission electron microscopy (TEM) study on defects in a 30 μm-thick epitaxial CZT film deposited on (001)GaAs via close-spaced sublimation was performed. The epi-layer is of good quality without twins. Dislocations and stacking faults are mainly gathered near the interface. The dislocations are extrinsic either of Lomer edge or 60° type. Pseudo extrinsic stacking faults consisting of two independent and oppositely oriented extrinsic dislocations have been found both on the (111) and the planes. L-shaped defects originated from the interface have been discovered. The near-interface-side of L is consisted of 3 compressed (111) planes and the lateral side is consisted of 3-4 misarranged planes. This L-shaped defect is induced by the absence of a misfit dislocation at the intersection between L and the interface.

Studies have revealed that different dislocation types have different influences on GaN device performance. Identification and discrimination of dislocation types in GaN films will be very helpful to understand the formation mechanism of each type of dislocation, and subsequently to work out corresponding methodologies to reduce each. In this work, two types of etched pits, inverted triangle and trapezoidal, were discovered in GaN films by AFM. Triangle ones were more quickly generated, and would transfer to the other with the increase in etching duration. Theoretical analysis from the viewpoint of strain energy of defects lets us to conclude that the former is from screw dislocation and the latter is formed by mixed dislocation. We consequently obtained the dislocation densities of each type, which agreed well with the XRD results. In summary, this work presents an easy but reliable approach to determine the type and corresponding density of dislocations in GaN.

II-VI compound semiconductor ZnO has a potential for high radiation hardness since large threshold displacement energy of constituent atoms can be expected due to the small unit-cell volume and large bandgap energy of 3.37 eV. In order to study the radiation hardness, singlecrystalline c-axis-oriented O-polar ZnO films with and without two-dimensional electron gas, a Zn-polar ZnO bulk crystal, and a Ga-polar GaN bulk crystal for comparison, were irradiated by an 8 MeV proton beam using a tandem-type accelerator. The radiation damage increased the electrical resistance and decreased the photoluminescence (PL) intensity of these samples with the increase of proton fluence over specific threshold values. In agreement with the expectation, ZnO samples were revealed to have superior radiation hardness; the threshold fluences for the deterioration of PL intensity were 3×1013 p/cm2 for the GaN bulk crystal, 2×1014 p/cm2 for the ZnO bulk crystal, and 5×1014 p/cm2 for the two ZnO films, in accordance with the order of the threshold fluences for the electrical resistance increase. The effect of post-irradiation annealing was also studied for these damaged bulk crystals; both electrical and optical properties of the ZnO bulk crystal were almost recovered to the pre-irradiation values, however, only the electrical properties of the GaN bulk crystal were recovered, by the annealing up to 700°C. Such a rapid recovery of the ZnO bulk crystal indicates the easy annihilation of Zn vacancy complexes acting as non-radiative centers by the recombination with interstitial Zn atoms. Since the migration barrier height energy of interstitial Zn atoms is known to be so small that it might occur even at room temperature, we ascribed the superior radiation hardness of ZnO crystals to the restoration of damage-induced defects by a self-annealing effect during irradiation.

The Single Solid Source precursor Cadmium Acetylacetonate, Cd[C5H7O2]2 was prepared and Cadmium Oxide thin films were deposited on Sodalime glass substrate using Metal Organic Chemical Vapour Deposition (MOCVD) technique at deposition temperature of 420 oC The films were characterized using Scanning Electron Microscopy (SEM) with Energy Dispersive XRay (EDX) facility attached to it, X-Ray Diffractometry (XRD) and UV-visible spectrometry. SEM micrographs showed the formation of textured surface with identifiable cubic and hexagonal structures, having average grain size greater than 1 μm. XRD studies indicated the formation of polycrystalline cubic CdO phase with preferred orientation in (111) plane. A direct optical band gap of 2.10 eV was obtained from the analysis of the UV-visible spectrum with an enhanced light absorption in 750 – 1000 nm spectrum range. This enhancement is as a result of light trapping by the textured crystalline structure.

In this paper, we compare degradation modes and failure mechanisms of different AlGaN/GaN HEMT technologies. We present data concerning reverse-bias degradation of GaN-based HEMTs, which results in a dramatic increase of gate leakage current, and present a timedependent model for gate degradation. Some of the tested technologies demonstrated to be immune from this failure mechanism up to drain-gate voltages in excess of 100 V. When this was the case, the main failure mode consisted of drain current degradation during on-state tests, resulting from charge trapping in the gate-drain access region attributed to hot-electron effects. Finally, the use of diagnostic techniques such as electroluminescence microscopy and Deep Level Transient Spectroscopy for the identification of failure modes and mechanisms of GaNbased HEMTs is reviewed. Concerning reverse-bias degradation of GaN-based HEMTs, we demonstrate that, (i) when submitted to reverse-gate stress, HEMTs can show both recoverable and permanent degradation. (ii) recoverable degradation consists of a decrease in gate current and threshold voltage, which are ascribed to the simultaneous trapping of negative charge in the AlGaN layer, and of positive charge close to the AlGaN/GaN interface. (iii) permanent degradation is manifested by the generation of parasitic leakage paths. Time-dependent analysis suggests that permanent degradation can be ascribed to a defect generation and percolation process. Results supports the existence of a time to breakdown for HEMT degradation, which significantly depends on the stress voltage level. On the contrary, AlGaN/GaN technologies which were found to be resistant to gate degradation (off-state critical voltage larger than 100 V for a 0.25 um gate device) were subjected to on-state tests at different gate and drain voltage levels. All tests showed a non-recoverable degradation of electrical parameters (drain saturation current, threshold voltage and on-state resistance) and electroluminescence signal EL, with a strong dependence on the EL value of the bias point, and a negligible dependence of temperature. Once verified that EL intensity represents a reliable estimate of channel hot electron effects, we attributed the degradation to hot electron trapping in the gate-drain access region. Using EL intensity as a measure of the stress acceleration factor, we derived an acceleration law for GaN HEMT hot electron degradation similar to the one already demonstrated for GaAs devices.

By using aberration corrected scanning transmission electron microscopy we have found no small scale lateral In composition fluctuations exist in the In0.15Ga0.85N active region of a light emitting diode. Images were acquired at 2% of the electron dose known to create electron beam damage, so the acquired images reflect the intrinsic structure of the InGaN active region. Position averaged convergent beam electron diffraction reveals the local sample thickness where images were acquired is 4.8 nm, eliminating the possibility that the absence of composition variation was observed due to projection through a thick sample. In addition, 2-3 atomic layer steps were observed in the top surface of In0.08Ga0.92N layers and the In0.15Ga0.85N active layers, providing a possible mechanism for lateral carrier confinement.

Two issues relating to the determination of junction position in thin film CdTe solar cells have been investigated. Firstly, the use of a focussed ion beam (FIB) milling as a method of sample preparation for electron beam induced current (EBIC) analysis is demonstrated. It is superior to fracturing methods. High quality secondary electron and combined secondary electron/EBIC images are presented and interpreted for solar cells with CdTe layers deposited by both close space sublimation (CSS) or RF sputtering. Secondly, it was shown that in an RF-sputtered CdTe device, while the photovoltaic junction was buried ~1.1 μm from the metallurgical interface, the shape of the external quantum efficiency (EQE) curve did not indicate the presence of a buried homo-junction. SCAPS modelling was used to verify that EQE curve shapes are not sensitive to junctions buried < 1.5μm from the CdTe/CdS interface.