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Co- and Fe-based multicomponent bulk metallic glasses designed by cluster line and minor alloying
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- 31 January 2011, pp. 1543-1550
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The mechanical properties of a surface-modified layer on polydimethylsiloxane
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- 31 January 2011, pp. 37-48
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Deformation of amorphous silicon nanostructures subjected to monotonic and cyclic loading
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- 31 January 2011, pp. 328-335
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Effects of rare earth on the structure and properties of Mg–6Zn–5Al–4Gd–1RE (RE = Ce or Y) alloys
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- 31 January 2011, pp. 2609-2621
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Upconversion luminescence properties of Li+-doped ZnWO4:Yb,Er
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- 31 January 2011, pp. 2078-2083
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Electromigration and thermomigration behavior of flip chip solder joints in high current density packages
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- 31 January 2011, pp. 2333-2339
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Precipitation- and stress-influenced coarsening in Mg-based Mg–Zn–Sn–Y and Mg–Zn–Sn–Sb alloys
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- 31 January 2011, pp. 1228-1236
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Hardness evolution of Al–Cr–N coatings under thermal load
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- 31 January 2011, pp. 2880-2885
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Berkovich indentation of diamondlike carbon coatings on silicon substrates
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- 31 January 2011, pp. 1862-1869
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Nanoindentation-derived elastic modulus of an amorphous polymer and its sensitivity to load-hold period and unloading strain rate
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- 31 January 2011, pp. 637-641
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Apatite-forming ability on titanium surface modified by hydrothermal treatment and ultraviolet irradiation
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- 31 January 2011, pp. 3169-3175
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Hydrothermal synthesis of Co-doped In2S3 micropompons and their physical properties
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- 31 January 2011, pp. 917-923
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Increasing the mean grain size in copper films and features
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- 31 January 2011, pp. 642-662
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Organic–inorganic sol-gel thick films for humidity barriers
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- 31 January 2011, pp. 2084-2090
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Time-resolved studies of the order–disorder phase transformations in rare-earth–transition metal intermetallics with 2-17 stoichiometry
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- 31 January 2011, pp. 2886-2896
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Hydrogen diffusion and effect of grain size on hydrogenation kinetics in magnesium hydrides
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- 31 January 2011, pp. 336-340
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Engineering aerosol-through-plasma torch ceramic particulate structures: Influence of precursor composition
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- 31 January 2011, pp. 1870-1876
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Electrochemical behavior of metal interconnects in electronic assemblies
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- 31 January 2011, pp. 2622-2629
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Constraints on removal of Si3N4 film with conformation-controlled poly(acrylic acid) in shallow-trench isolation chemical–mechanical planarization (STI CMP)
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- 31 January 2011, pp. 49-54
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Microwave dielectric properties and vibrational spectroscopic analysis of MgTe2O5 ceramics
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- 31 January 2011, pp. 1551-1556
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