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Transformation-induced plasticity in Fe–Cr–V–C
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- 31 January 2011, pp. 368-374
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Erratum: Corrigendum to “Thermochemistry of glass forming Y-substituted Sr-analogues of titanite (SrTiSiO5)” [J. Mater. Res. 24(11), 3380 (2009)]
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- 31 January 2011, pp. 2054-2055
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Oriented single-crystalline TiO2 nanowires on titanium foil for lithium ion batteries
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- 31 January 2011, pp. 1588-1594
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Photoelectrochemical solar cells made from SnO2/ZnO films sensitized with an indoline dye
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- 31 January 2011, pp. 1838-1841
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Correlation between fracture surface morphology and toughness in Zr-based bulk metallic glasses
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- 31 January 2011, pp. 982-990
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Synthesis and tunable photoluminescence of NaYF4:Eu/Ba nanocrystals
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- 31 January 2011, pp. 2422-2425
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Precipitation of the ZrCu B2 phase in Zr50Cu50–xAlx (x = 0, 4, 6) metallic glasses by rapidly heating and cooling
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- 31 January 2011, pp. 793-800
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Study on the role of tarnishing film in stress-corrosion cracking of brass in Mattsson's solution
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- 31 January 2011, pp. 991-998
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Preparation of CuIn(SxSe1–x)2 thin films with tunable band gap by controlling sulfurization temperature of CuInSe2
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- 31 January 2011, pp. 2426-2429
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Microstructure investigations of Pt-modified γ′-Ni3Al + γ-Ni coatings on Ni-based superalloys
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- 31 January 2011, pp. 1191-1195
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Erratum: “Influence of casting temperature on microstructures and mechanical properties of Cu50Zr45.5Ti2.5Y2 metallic glass prepared using copper mold casting” [J. Mater. Res. 24, 3108 (2009)]
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- 31 January 2011, p. 605
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Structural and electrical properties of AlxIn1-xN (0.10≤x≤0.94) films grown on sapphire substrates
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- 31 January 2011, pp. 1842-1846
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Electrospun Teflon AF fibers for superhydrophobic membranes
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- 31 January 2011, pp. 1595-1600
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Improving plasticity and toughness of Cu-Zr-Y-Al bulk metallic glasses via compositional tuning towards the CuZr
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- 31 January 2011, pp. 375-382
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Antiphotocorrosive photocatalysts containing CdS nanoparticles and exfoliated TiO2 nanosheets
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- 31 January 2011, pp. 182-188
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Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization
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- 31 January 2011, pp. 1847-1853
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In situ and ex situ transmission electron microscopy investigation of Cu–Al–Cu–Ti reactive metallic multilayer coatings
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- 31 January 2011, pp. 1196-1203
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The effect of annealing temperature on the structural, optical, and electrical properties of CdS films
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- 31 January 2011, pp. 189-196
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Investigations on interfacial reactions at reentrant corners
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- 31 January 2011, pp. 999-1003
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Structural complexity of layered-spinel composite electrodes for Li-ion batteries
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- 31 January 2011, pp. 1601-1616
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