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Indentation damage evaluation on metal-coated thin-films stacked structure

Published online by Cambridge University Press:  21 September 2015

Alfred Yeo ,
Mao Liu  and
Kun Zhou
Alfred Yeo
Affiliation:
Operation Backend Development, Infineon Technologies Asia Pacific Pte Ltd, Singapore349253; and School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore639798
Mao Liu
Affiliation:
School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore639798
Kun Zhou*
Affiliation:
School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore639798
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

A micro-indentation system integrated with an acoustic emission (AE) sensor is used as a damage test method for crack detection of the specimen during the indentation loading–unloading cycle. The specimens investigated are the Si die, and various stacked structures of metallization (Al or Cu) deposited over the dielectric layers (SiO2 or Si3N4) on the Si substrate. The 1st AE event detected during the loading stage corresponded to the ‘pop-in’ observation in the force–displacement curve, which was related to the brittle cracking in the dielectric or Si substrate. However, during unloading, a 2nd AE event was detected, but no “pop-out” was observed, which was mainly due to the delamination between the dielectric and Si substrate. It was also found that for Si die, “pop-out” was observed without any AE event during the unloading stage, which was related to the Si phase transformation. This observation is unique to sharp indenter tip but not for a blunt indenter tip.

Keywords

acoustic emissioncoatingdielectricindentation damage
Type
Articles
Information
Journal of Materials Research , Volume 30 , Issue 20 , 28 October 2015 , pp. 3071 - 3083
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Sneddon, I.N.: The relationship between load and penetration in the axisymmetric Boussinesq problem for a punch of arbitrary profile. Int. J. Eng. Sci. 3, 47–57 (1965).CrossRefGoogle Scholar
Lawn, B.R. and Wilshaw, R.: Review indentation fracture: Principles and applications. J. Mater. Sci. 10, 1049–1081 (1975).CrossRefGoogle Scholar
Lawn, B.R. and Marshall, D.B.: Indentation fracture and strength degradation in ceramics. Fract. Mech. Ceram. 3, 205–229 (1975).Google Scholar
Lawn, B.R. and Marshall, D.B.: Hardness, toughness, and brittleness: An indentation analysis. J. Am. Ceram. Soc. 62(7–8), 347–350 (1979).CrossRefGoogle Scholar
Lawn, B.R., Evans, A.G., and Marshall, D.B.: Elastic/plastic indentation damage in ceramics: The median/radial crack system. J. Am. Ceram. Soc. 63(9–10), 574–581 (1980).Google Scholar
Anstis, G.R., Chantikul, P., Lawn, B.R., and Marshall, D.B.: A critical evaluation of indentation techniques for measuring fracture toughness. I. Direct crack measurements. J. Am. Ceram. Soc. 64(9), 533–538 (1981).Google Scholar
Anstis, G.R., Chantikul, P., Lawn, B.R., and Marshall, D.B.: A critical evaluation of indentation techniques for measuring fracture toughness. II. Strength method. J. Am. Ceram. Soc. 64(9), 539–543 (1981).Google Scholar
Doerner, M.F. and Nix, W.D.: A method for interpreting the data from depth-sensing indentation instruments. Journal of Material Research 1, 601–609 (1986).CrossRefGoogle Scholar
Oliver, W.C. and Pharr, G.M.: An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation measurements. J. Mater. Res. 7, 1564–1583 (1992).Google Scholar
Sakai, M.: Energy principle of the indentation-induced inelastic surface deformation and hardness of brittle materials. Acta Mater. 41(6), 1751–1758 (1993).CrossRefGoogle Scholar
Harding, D.S., Oliver, W.C., and Pharr, G.M.: Cracking during nanoindentation and its use in the measurement of fracture toughness. Mater. Res. Soc. Proc. 356, 663–668 (1995).Google Scholar
Cheng, C.M. and Cheng, Y.T.: On the initial unloading slope in indentation of elastic-plastic solids by an indenter with an axisymmetric smooth profile. Appl. Phys. Lett. 71, 2623 (1997).Google Scholar
Pharr, G.M.: Measurement of mechanical properties by ultra-low load indentation. Mater. Sci. Eng., A 253, 151–159 (1998).Google Scholar
Cheng, Y.T. and Cheng, C.M.: Relationships between hardness, elastic modulus, and the work of indentation. Appl. Phys. Lett. 73(5), 614–616 (1998).Google Scholar
Hu, X.Z. and Lawn, B.R.: A simple indentation stress–strain relation for contacts with spheres on bilayer structures. Thin Solid Film 322, 225–232 (1998).CrossRefGoogle Scholar
Alcala, J., Gaudette, F., Suresh, S., and Sampath, S.: Instrumented spherical micro-indentation of plasma-sprayed coatings. Mater. Sci. Eng., A 316, 1–10 (2001).Google Scholar
Volinsky, A.A., Vella, B.J., and Gerberich, W.W.: Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation. Thin Solid Films 429, 201–210 (2003).Google Scholar
VanLandingham, M.R.: Review of instrumented indentation. J. Res. Natl. Inst. Stand. Technol. 108, 249–265 (2003).Google Scholar
Oliver, W.C. and Pharr, G.M.: Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology. J. Mater. Res. 19(1), 1–20 (2004).CrossRefGoogle Scholar
Van Vliet, K.J., Prchlik, L., and Smith, J.F.: Direct measurement of indentation frame compliance. J. Mater. Res. 19, 325–333 (2004).Google Scholar
Franco, A.R. Jr., Pintaúdeb, G., Sinatoraa, A., Pinedoc, C.E., and Tschiptschina, A.P.: The use of a vickers indenter in depth sensing indentation for measuring elastic modulus and vickers hardness. Mater. Res. 7(3), 483–491 (2004).Google Scholar
Xia, Z.H., Curtin, W.A., and Sheldon, B.W.: A new method to evaluate the fracture toughness of thin films. Acta Mater. 52, 3507–3517 (2004).Google Scholar
Jung, Y-G., Lawn, B.R., Martyniuk, M., Huang, H., and Hu, X.Z.: Evaluation of elastic modulus and hardness of thin films by nanoindentation. J. Mate. Res. 19(10), 3076–3080 (2004).Google Scholar
Chen, S., Liu, L., and Wang, T.: Investigation of the mechanical properties of thin films by nanoindentation, considering the effects of thickness and different coating–substrate combinations. Surf. Coat. Technol. 191, 25–32 (2005).Google Scholar
Farrissey, L.M. and McHugh, P.E.: Determination of elastic and plastic material properties using indentation: Development of method and application to a thin surface coating. Mater. Sci. Eng., A 399, 254–266 (2005).CrossRefGoogle Scholar
Helvaci, F. and Cho, J.: A nanoindentation study of thermally-grown-oxide films on silicon. Mater. Res. Soc. Symp. Proc. 841, 375–380 (2005).Google Scholar
Etsion, I., Kligerman, Y., and Kadin, Y.: Unloading of an elastic–plastic loaded spherical contact. Int. J. Solids Struct. 42, 3716–3729 (2005).Google Scholar
Lim, Y.Y. and Chaudhri, M.M.: Indentation of elastic solids with a rigid Vickers pyramidal indenter. Mech. Mater. 38, 1213–1228 (2006).Google Scholar
Lee, J.S., Jang, J., Lee, B.W., Choi, Y., Lee, S.G., and Kwon, D.: An instrumented indentation technique for estimating fracture toughness of ductile materials: A critical indentation energy model based on continuum damage mechanics. Acta Mater. 54, 1101–1109 (2006).CrossRefGoogle Scholar
Sergejev, F. and Antonov, M.: Comparative study on indentation fracture toughness measurements of cemented carbides. Proc. Est. Acad. Sci. Eng. 12(4), 388–398 (2006).Google Scholar
Chen, J. and Bull, S.J.: Assessment of the toughness of thin coatings using nanoindentation under displacement control. Thin Solid Films 494(1–2), 1–7 (2006).CrossRefGoogle Scholar
Chen, J. and Bull, S.J.: Modelling the limits of coating toughness in brittle coated systems. Thin Solid Films 517(9), 2945–2952 (2009).CrossRefGoogle Scholar
Kruzica, J.J., Kimb, D.K., Koesterc, K.J., and Ritchiec, R.O.: Indentation techniques for evaluating the fracture toughness of biomaterials and hard tissues. J. Mech. Behav. Biomed. Mater. 2, 384–395 (2009).Google Scholar
Chen, J.: Indentation-based methods to assess fracture toughness for thin coatings. J. Phys. D: Appl. Phys. 45(20), 1–14 (2012).Google Scholar
Zhang, S. and Zhang, X.M.: Toughness evaluation of hard coatings and thin films. Thin Solid Films 520, 2375–2389 (2012).Google Scholar
Kucharski, S. and Mroz, Z.: Identification of yield stress and plastic hardening parameters from a spherical indentation test. Int. J. Mech. Sci. 49, 1238–1250 (2007).Google Scholar
Yan, W.Y., Sun, Q.P., and Hodgson, D.P.: Determination of plastic yield stress from spherical indentation slope curve. Mater. Lett. 62, 2260–2262 (2008).Google Scholar
Kang, S-K., Kim, J-Y., Park, C-P., Kim, H-U., and Kwon, D.: Conventional Vickers and true instrumented indentation hardness determined by instrumented indentation tests. J. Mater. Res. 25(2), 337–343 (2010).Google Scholar
Fischer-Cripps, A.C.: Nanoindentation. 3rd ed. (Springe, New York, 2011).CrossRefGoogle Scholar
Yeo, A., Yong, E., Dan, S.T., and Ruether, G.M.: A novel damage test evaluation of IC bond pad stack strength. In Proceedings of 15th Electronics Packaging Technology Conference; IEEE, Singapore, 2013; pp. 40–43.Google Scholar
Yeo, A., Yong, E., and Zhou, K.: Compliance compensation analysis of micromechanical tester integrated with acoustic emission sensors. IEEE Trans. Device Mater. Reliab. 14(3), 898–903 (2014).Google Scholar
Madou, M.J.: Fundamentals of Microfabrication (CRC Press, Boca Raton, FL, 1997).Google Scholar
Change, L. and Zhang, L.C.: Deformation mechanisms at pop-out in monocrystalline silicon under nanoindentation. Acta Mater. 57, 2148–2153 (2009).Google Scholar