Most publications on (opto)electronic devices based on 2D materials rely on single monolayers embedded in classical 3D semiconductors, dielectrics and metals. However, heterostructures of different 2D materials can be employed to tailor the performance of the 2D components by reduced defect densities, carrier or exciton transfer processes and improved stability. This translates to additional and unique degrees of freedom for novel device design. The nearly infinite number of potential combinations of 2D layers allows for many fascinating applications. Unlike mechanical stacking, metal-organic vapour phase epitaxy (MOVPE) can potentially provide large-scale highly homogeneous 2D layer stacks with clean and sharp interfaces. Here, we demonstrate the direct successive MOVPE of MoS2/WS2 and WS2/MoS2 heterostructures on 2” sapphire (0001) substrates. Furthermore, the first deposition of large-scale MoS2/graphene and WS2/graphene heterostructures using only MOVPE is presented and the influence of growth time on nucleation of WS2 on graphene is analysed.

The authors summarize the results of selective-area growth of vertical MnAs/InAs heterojunction nanowire (NW) arrays and present a preliminary characterization of the transport properties of a single MnAs/InAs heterojunction NW and a single InAs host NW for MnAs inclusions. During the endotaxy of MnAs after the selective-area growth of host InAs nanowires (NWs) on partially SiO2-masked GaAs(111)B substrates, hexagonal NiAs-type MnAs nanoclusters (NCs), which exhibit spontaneous magnetization at room temperature, are formed with the 〈0001〉 direction oriented parallel to the 〈111〉B direction of the zinc-blende-type InAs host NWs. For InAs host NWs, a large positive ordinary magnetoresistance (MR) effect up to 165% is observed at temperatures between 7 and 280 K. In addition, magnetotransport measurements reveal universal conductance fluctuations and a weak Anderson localization at temperatures up to 20 K due to a charge-accumulation layer formed at the surface. Single MnAs/InAs heterojunction NWs, however, exhibit only a negative MR effect, which is independent of temperature T < 10 K and linearly decreases up to −10% at 10 T with increasing magnetic field. These results reveal the tremendous influence of ferromagnetic NCs on the transport behavior inside the InAs host NWs.

The 2D transition metal dichalcogenide (TMDC) tungsten disulfide (WS2) has attracted great interest due to its unique properties and prospects for future (opto)electronics. However, compared to molybdenum disulfide (MoS2), the development of a reproducible and scalable deposition process for 2D WS2 has not advanced very far yet. Here, we report on the systematic investigation of 2D WS2 growth on hydrogen (H2)-desorbed sapphire (0001) substrates using a hydrogen sulfide (H2S)-free metal-organic vapor phase epitaxy (MOVPE) process in a commercial AIXTRON planetary hot-wall reactor in 10 × 2" configuration. Tungsten hexacarbonyl (WCO, 99.9 %) and di-tert-butyl sulfide (DTBS, 99.9999 %) were used as MO sources, nitrogen (N2) was selected as carrier gas for the deposition processes (standard growth time 10 h). In an initial study, the impact of growth temperature on nucleation and growth was investigated and an optimal value of 820 °C was found. The influence of the WCO flow on lateral growth was investigated. The aim was to maximize the edge length of triangular crystals as well as the total surface coverage. Extending gradually the growth time up to 20 h at optimized WCO flow conditions yields fully coalesced WS2 samples without parasitic carbon-related Raman peaks and with only sparse bilayer nucleation. After substrate removal, a fully coalesced WS2 film was implemented into a light-emitting device showing intense red electroluminescence (EL).

Reduction in background carrier concentration has been investigated for 4H-SiC C-face epitaxial growth in order to be applied for ultra-high voltage power devices. Optimizing epitaxial growth parameters made it possible to achieve 7.6x1013 cm-3 as the background carrier concentration within a whole area of specular 3-inch wafers. In addition to the background carrier concentration reduction, epitaxial film thickness variation, surface defect density and the carrier lifetime have been confirmed to fulfill the requirements for the devices.

We have studied photoluminescence (PL) from undoped GaN films grown by HVPE technique on sapphire. Several defect-related PL bands are observed in the low-temperature PL spectrum. The concentrations of the defects responsible for these PL bands are determined from the dependence of PL intensity on excitation intensity. The RL band with a maximum at 1.8 eV is often the dominant PL band in HVPE GaN. It is caused by an unknown defect with the concentration of up to ∼1017 cm-3. The concentrations of defects responsible for other defect-related PL bands rarely exceed 1015 cm-3.

A quantum computer will have computational power beyond that of conventional computers, which can be exploited for solving important and complex problems, such as predicting the conformations of large biological molecules. Materials play a major role in this emerging technology, as they can enable sophisticated operations, such as control over single degrees of freedom and their quantum states, as well as preservation and coherent transfer of these states between distant nodes. Here we assess the potential of semiconductor nanowires grown from the bottom-up as a materials platform for a quantum computer. We review recent experiments in which small bandgap nanowires are used to manipulate single spins in quantum dots and experiments on Majorana fermions, which are quasiparticles relevant for topological quantum computing.

We report on the maskless integration of micron-sized GaAs crystals on patterned Si substrates by metal organic vapor phase epitaxy. In order to adapt the mismatch between the lattice parameter and thermal expansion coefficient of GaAs and Si, 2 μm tall Ge crystals were first grown as virtual substrate by low energy plasma enhanced chemical vapor deposition. We investigate the morphological evolution of the GaAs structures grown on top of the Ge crystals at the transition towards full pyramids with energetically stable {111} facets. A substantial release of strain is shown in GaAs crystals with a height of 2 μm and lateral sizes up to 15×15 μm2 by both X-ray diffraction and photoluminescence.

Corundum structured α-(GaFe)2O3 alloy thin films were obtained on c-plane sapphire substrates by the mist chemical vapor deposition method. Wide range of X-ray diffraction 2θ/θ scanning measurements indicated that these crystals were epitaxially grown on c-plane sapphire substrates and these are no other crystal oriented phase. The cross-sectional and plane-view transmission electron microscope images showed the growth along the c-axis of α-(GaFe)2O3 thin films on sapphire substrates, forming joint of columnar structure. The non-doped α-(GaFe)2O3 thin films showed ferromagnetic properties at 300 K, though the origin of ferromagnetism still remained unresolved. In order to enhance the spin-carrier interaction, Sn doped α-(GaFe)2O3 alloy thin films were fabricated on c-plane sapphire substrates. X-ray diffraction 2θ/θ and ω scanning measurement results indicated that the highly-crystalline films were epitaxially grown on substrates in spite of the Sn-doping.

GaP, GaAs, and InP nanowires were grown on graphitic layers by the vapor-liquid-solid method in a metalorganic vapor phase epitaxy chamber. On graphene/SiC(0001), Au particles as catalyst were formed at the steps by controlling the Au deposition rate and the annealing temperature in a low-energy electron microscopy system. GaP nanowires were grown on this substrate, and it was found that vertical nanowires were formed at the steps of the surface. We also performed GaP, GaAs, and InP nanowire growth on graphite substrates. Free-standing nanowires were obtained for all three materials, although they were vertically, diagonally, and laterally-oriented at the same time. The results suggested that the growth at the steps is the key to growing nanowires vertically on graphene surface.

Resonant cavity light emitting diode (RCLED) structure was grown using digital AlGaN/GaN Distributed Bragg Reflector (DBR) and Ag-based p-contact. A five period of InGaN/GaN multi-quantum well (MQW) layers are placed between these two high reflectance mirrors. Digital AlGaN/GaN DBR have a maximum reflectivity of about 60 % at 445 nm and 90 % at 439 nm for 6 period and 12 period, respectively. Ag-based p-contact exhibits an average reflectance of around 85-90 % for a wavelength of 400-600 nm. The light output intensity of the RCLEDs with 12 period digital AlGaN/GaN DBR is higher by a factor of 3 as compared to that of the similar structure without digital AlGaN/GaN DBR at an injection current of 50 mA.

Orientation patterned (OP)-GaAs crystals have high potential as non linear optical systems. Mid-infrared and terahertz lasers sources can be fabricated with these crystals by frequency conversion from shorter wavelength sources. The optical propagation losses are critical; therefore, the OP-GaAs crystals must have high quality with low incorporation of defects and high homogeneity to reduce the refractive index fluctuations. Defects with electro-optic signature must be characterized in order to reduce their presence. Cathodoluminescence studies of these crystals permit the distribution of the main defects to be established, both extended and point defects. Special attention is paid to the role of the walls between the two domain orientations, and to the incorporation of impurities in Si-doped samples.

NiO is a typical material for new p-type oxide semiconductors. Conductivity of NiO can be raised with Li+ doping. In case of Li-heavy doping, we can obtain LixNiO2(0.5< × <1.0). Recently the importance of LiNiO2 has been increased as an electrode material for rechargeable lithium cells.

In this work, we tried to fabricate a novel NiO material with Li+-heavily doped by applying the pulsed laser-induced room temperature (R.T.) film process. Previously, we have succeeded in the epitaxial growth of various oxide thin films at R.T. such as Sn-doped In2O3 transparent electrodes [1]. Although the many studies have been made on the deposition of NiO epitaxial thin film at low temperatures [2], there are few reports on fabrication and the conductive characteristic for Li-heavily doped NiO epitaxial films. The film deposition at R.T., which is the unequilibrium vapor phase process, is expected to result in different crystal structure and characteristics from the films grown at high-temperatures.

A composition-adjusted thin film of LixNi1-xO(0.10< × <0.40) was deposited on a sapphire (α-Al2O3)(0001) or MgO(100) substrates by pulsed laser deposition (PLD) technique in 10−6 Torr of oxygen at R.T. and the high temperatures of 350 and 515°C. Crystalline properties of thin films deposited at R.T. or high temperatures were examined using reflection high energy electron diffraction (RHEED) and X-ray diffraction. For the Li-heavily doped NiO films(x>0.30) grown at R.T., a clear streak RHEED pattern showing epitaxial growth was observed. But the Li-heavily doped NiO films grown at high temperatures, exhibited the ring RHEED pattern, which indicates the policrystal growth of films. Electric conductivity of various Li-doped NiO thin films deposited at R.T. or high temperatures on sapphire (0001) substrates were measured by two-probe method. The interesting results were obtained that conductivity of the film was increased remarkably with an increase of Li-doping for R.T. deposition, but was not changed so much regardless of Li-doping for high-temperature depositions.

Selective area growth (SAG) of a-plane GaN grown on r-plane sapphire with a stripe orientation along <1-100> was investigated. The key technology of facet-control is optimizing the growth temperature and the reactor pressure. Our experiments reveal that the growth temperature determined facet form: in samples grown at 1000 °C, the structure consists of {11-22}and (000-1); with increasing growth temperature to 1050 °C, the area of {11-22} facet gradually decreases, and two new planes, (0001) and {11-20} facets form; eventually, in samples grown at 1000 oC, the {11-22} facet completely disappears, (0001) and {11-20} facet continue to increase to form a rectangle cross-section. The reactor pressure determines the ratio of the lateral growth rate and the vertical growth rate: with reactor pressure decreasing from 500 torr to 100 torr, the rectangle structure gradually decreases the height and increases the width, and the volume nearly keeps constant.

In this paper, we review our efforts in the spectroscopic detector development using epitaxially grown thick single crystal films of CdTe. The films were grown on GaAs and Si substrates using metalorganic vapor phase epitaxy growth technique. High crystalline quality thick single crystal CdTe films (>260 μm) were obtained where the growth rates could be varied from 10 to 70 μm/h by adjusting the precursor's flow rates, ratios and the substrate temperatures. Spectroscopic detectors were fabricated in a p-CdTe/n-CdTe/n+-GaAs or p-CdTe/n-CdTe/n+-Si heterojunction diode structure. Both types of detector were capable of detecting and resolving energy peaks from a gamma ray source. However, the spectroscopic performance of p-CdTe/n-CdTe/n+-Si detectors was better than that of the p-CdTe/n-CdTe/n+-GaAs detectors. Details on the growth characteristics, detector fabrication and the detector performance are reported. Furthermore, current challenges in this detector fabrication technique are discussed.

We report selective area epitaxy of InGaN/GaN micron-scale stripes and rings on patterned (0001) AlN/sapphire. The objective is to elevate indium incorporation for achieving blue and green emission on semi-polar crystal facets. In each case, GaN structures were first produced, and the InGaN quantum wells (QWs) were subsequently grown. The pyramidal InGaN/GaN stripe along the <11-20> direction has uniform CL emission at 500 nm on the smooth {1-101} sidewall and at 550 nm on the narrow ridge. In InGaN/GaN triangular rings, the structures reveal smooth inner and outer sidewall facets falling into a single type of {1-101} planes. All these {1-101} sidewall facets demonstrate similar CL spectra which appear to be the superposition of two peaks at positions 500 nm and 460 nm. Spatially matched striations are observed in the CL intensity images and surface morphologies of the {1-101} sidewall facets. InGaN/GaN hexagonal rings are comprised of {11-22} and {21-33} facets on inner sidewalls, and {1-101} facets on outer sidewalls. Distinct CL spectra with peak wavelengths as long as 500 nm are observed for these diverse sidewall facets of the hexagonal rings.

High crystal quality crack-free AlN on sapphire was grown by low pressure metal organic vapor phase epitaxy (MOVPE). Growth experiments combine two recent approaches: the ammonia pulse-flow method and ammonia continuous-flow growth mode by varying the V/III ratio. The detailed aspects of MOVPE, employing the periodic multilayer approach at low, intermediate, and high temperatures are described. This method yields significant reduction of screw dislocation density and provides very smooth surface for thin AlN layers.

Low dislocation density epitaxial layers of AlxGa1-xN can be grown pseudomorphically on c-face AlN substrates prepared from high quality, bulk crystals. Here, we will report on initial characterization results from deep ultraviolet (UV) light emitting diodes (LEDs) which have been fabricated and packaged from these structures. As reported previously, pseudomorphic growth and atomically smooth surfaces can be achieved for a full LED device structure with an emission wavelength between 250 nm and 280 nm.

A benefit of pseudomorphic growth is the ability to run the devices at high input powers and current densities. The high aluminum content AlxGa1-xN (x∼70%) epitaxial layer can be doped n-type to obtain sheet resistances < 200 Ohms/sq/μm due to the low dislocation density. Bulk crystal growth allows for the ability to fabricate substrates of both polar and non-polar orientations. Non-polar substrates are of particular interest for nitride growth because they eliminate electric field due to spontaneous polarization and piezoelectric effects which limit device performance. Initial studies of epitaxial growth on non-polar substrates will also be presented.

Indium Gallium Nitride (InxGa1-xN) alloys are currently playing an ever increasing role in optoelectronic devices as the bandgap of such alloys can theoretically be tuned between 0.7eV and 3.4eV–covering the entire visible spectrum. Although growth of high quality InxGa1-xN alloys with high indium mole fractions are difficult or presently unattainable, InGaN alloys are still a viable choice for light emitters and detectors over the visible (blue/green) to ultraviolet spectrum. However, many inherent problems during InGaN growth via Metal Organic Vapor Phase Epitaxy (MOVPE) arise due to the large lattice mismatch and low miscibility between GaN and InN–leading to the formation of Inverted Hexagonal Pyramid (IHP) defects at the termination of threading dislocations. Additionally, growth of InGaN at lower temperatures to promote increased indium incorporation results in poor surface morphology. Several methods such as strained layer superlattices and low mole fraction InGaN layers before the growth of the InGaN/GaN MQW structures have been shown to relive strain in the MQWs, thus reducing the density of IHP defects and/or improving the optical output characteristics. This work focuses on the application of GaN monolayer insertions during InGaN quantum well growth via Metal Organic Vapor Phase Epitaxy (MOVPE) as a means to reduce the IHP defect density and passivate effects on surface roughness while observing variations in indium concentration. Observations include the reduction of IHP defect density by nearly twofold as the number of GaN monolayer interruptions increase from zero to three while sustaining only slightly lower effective indium concentrations.

c-plane (0001) AlN layers were grown on sapphire (11-20) and (0001) substrates by hydride vapor phase epitaxy (HVPE) and metal-organic vapor phase epitaxy (MOVPE), respectively. The growth temperatures were adjusted from 1430-1500 °C and the reactor pressure was kept constant at 30 Torr. Mirror and flat c-plane AlN were obtained grown on both a-plane and c-plane sapphire. Crystalline quality and surface roughness are improved with increasing growth temperature, detected by high resolution X-ray diffraction (HRXRD) and atomic force microscopy (AFM). The Full widths at half maximum (FWHM) values of (10-12) diffraction are 519 and 1219 arcsec for c-plane AlN grown on a-plane sapphire and c-plane sapphire, respectively. It indicates that a-plane sapphire substrate benefits to decrease dislocations density.

The growth of thick silicon carbide (SiC) epitaxial layers for large-area, high-power devices is described. Horizontal hot-wall epitaxial reactors with a capacity of three, 3-inch wafers have been employed to grow over 350 epitaxial layers greater than 100 μm thick. Using this style reactor, very good doping and thickness uniformity and run-to-run reproducibility have been demonstrated. Through a combination of reactor design and process optimization we have been able to achieve the routine production of thick epitaxial layers with morphological defect densities of around 1 cm−2. The low defect density epitaxial layers in synergy with improved substrates and SiC device processing have resulted in the production of 10 A, 10 kV junction barrier Schottky (JBS) diodes with good yield (61.3%).