The thermal expansion coefficient (CTE) is a vital design parameter for reducing the thermal-stress-induced structural failure of electronic chips/devices. At the micro- and nano-scale, the typical size range of the components in chips/devices, the CTEs are probably different from that of the bulk materials, but an easy and accurate measurement method is still lacking. In this paper, we present a simple but effective method for determining linear CTEs of micro-scale materials only using the prevalent nanoindentation system equipped with a heating stage for precise temperature control. By holding a constant force on the sample surface, while heating the sample at a constant rate, we measure two height–temperature curves at two positions, respectively, which are close to each other but at different heights. The linear CTE is obtained by analyzing the difference of height change during heating. This method can be applied to study the size effect or surface effect of CTE of embedded micro-scale structures, aiding the failure analysis and structural design in the semiconductor industry.

Intermetallic γ-TiAl-based alloys are commonly used as structural materials for components in high-temperature applications, although they generally suffer from a lack of ductility and crack resistance at ambient temperatures. Within this study, the process-adapted 4th generation TNM+ alloy, exhibiting a fully lamellar microstructure, was examined using notched micro-cantilevers with defined orientations of lamellar interfaces. These configurations were tested in situ using superimposed continuous stiffness measurement methods during loading with simultaneous scanning electron microscopy observations. Subsequently, the video signal was used for visual crack length determination by computer vision and compared to values calculated from in situ changes in stiffness data. Applying this combinatorial approach enabled to determine the J-integral as a measure of the fracture toughness for microstructurally different local crack propagation paths. Thus, distinct differences in conditional fracture toughness could be determined from 3.7 MPa m1/2 for γ/γ-interface to 4.4 MPa m1/2 for α2/γ-interface.