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Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration
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- Journal:
- Journal of Materials Research / Volume 29 / Issue 21 / 14 November 2014
- Published online by Cambridge University Press:
- 08 September 2014, pp. 2556-2564
- Print publication:
- 14 November 2014
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- Article
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