This issue of MRS Bulletin provides an overview of the state of the art and emerging trends in the area of adhesives. An adhesive is basically defined by its function, which is to assemble two surfaces together. In order to fulfill this function, the properties of an adhesive must include easy positioning at the interface, rapid and complete bond formation and subsequent hardening, and a bond strength adapted to the specific application (structural, permanent, removable, rigid, or soft). A variety of solutions exist in practice, and their application requires an understanding both of polymer chemistry and materials science. The main families of adhesives, their properties, and their basic design principles will be discussed in the articles in this issue, while this introductory article presents an overview of the functions required of adhesives and future trends.

Soft reactive adhesives (SRAs) are polymer-based materials (e.g., polyurethanes, polysiloxanes, polydienes) designed to be further vulcanized or slightly cross-linked through external activation (heat, moisture, oxygen, UV–visible irradiation, etc.), either at the time of their application or within a subsequent predefined period. They are used mainly as mastics, or sealing compounds, in a wide range of industrial and commercial fields such as construction, footwear, and the automotive industry. Generally deposited as thick films, SRAs behave as structural adhesives; their low elastic moduli accommodate large strains between the bonded parts without incurring permanent damage. Other outstanding attributes of SRAs are their resistance to solvents, their ability to withstand aggressive environments, and their ease of use. This article discusses examples of SRAs and, more specifically, shows how the cross-linking chemistry, mainly through step-growth polymerization, provides their primary advantages.

Although adhesives, particularly those based on epoxy resins, are finding increasing use in structural applications, their utilization at elevated temperature (>150°C) has been limited by their relatively poor thermal and thermo-oxidative stability. As a result, significant effort has been directed in recent years toward the development of polymers exhibiting increased thermal resistance. Although a wealth of research conducted over several decades has resulted in a myriad of polymer types exhibiting, in some cases, impressive high-temperature performance, many systems have demonstrated poor processability Thus, much emphasis has been placed on developing high-temperature performance while providing processability characteristics that are similar, if not identical, to epoxies. This article considers the various approaches that have been shown to offer such dual capabilities. In addition, the results of various studies undertaken to investigate the effects of elevated temperature on the strength and fatigue resistance of bonded joints are reported.

Self-adhesive materials are called, in the adhesives trade, “pressure-sensitive adhesives” (PSAs). PSAs are designed to stick on almost any surface by simple contact under light pressure. This special class of adhesives does not undergo any physical transformation or chemical reaction during the bonding process. Because of this, the rheological properties of the adhesive must be finely tuned for the application, combining a carefully chosen polymer architecture and monomer composition with the proper addition of small molecules called tackifying resins. PSAs are soft, deformable solids and, depending on the formulation, easily form bridging fibrils between two surfaces upon debonding. They are safe to use and easy to handle and thus are increasingly replacing more conventional types of adhesives. In this article, we review both the primary material characteristics of PSAs and the main physical principles that make them work effectively.

Hot-melt adhesives facilitate fast production processes because the adhesives set simply by cooling. Formulations contain polymers to provide strength and hot tack (resistance to separation while adhesive is hot), and tackifiers and/or oils to dilute the polymer entanglement network, adjust the glass-transition temperature, lower the viscosity, and improve wet-out (molecular contact of the adhesive with the substrate over the entire bonding area). Some adhesives also contain waxes to speed setting, lower viscosity, and improve heat resistance. Obtaining adequate strength and heat resistance from nonreactive hot melts requires that some component of the hot melt separate out into a dispersed but interconnected hard-phase network upon cooling. The hard phases are commonly either glassy styrene domains (for adhesives based on styrenic block copolymers) or organic crystallites (for adhesives based on waxes, olefinic copolymers, or ethylene copolymers). This article will describe first the material properties relevant to the processing and performance of hot-melt adhesives, then the chemistry and function of the specific raw materials used in hot melts, and will conclude with illustrative application examples and corresponding formulations.

There are many advantages that polymeric adhesives can offer compared with the more traditional methods of structural joining such as bolting, brazing, welding, and mechanical fastening, and epoxy adhesives represent the most common type of structural adhesive. When polymerized, epoxy adhesives are amorphous and highly cross-linked materials, and this microstructure results in many useful properties for structural engineering applications, such as a high modulus and failure strength, low creep, and, by careful formulation, good performance at elevated temperatures. However, the structure of such thermosetting adhesives also generally leads to one highly undesirable property: they are relatively brittle materials, with poor resistance to crack initiation and growth. Nevertheless, the incorporation of a second phase of dispersed rubbery particles into the epoxy polymer can greatly increase their toughness without significantly impairing their other desirable engineering properties. Thus, rubber-toughened epoxy adhesives can be used, for example, in applications where very high impact resistance is required for the bonded joint.

A number of different types of adhesives are used in the assembly of electronic components and devices. This article provides an overview of such adhesives that also have another job–they work at conducting electricity or heat. The resins or binders in these adhesives range from thermosetting to pressure-sensitive. Conductivity is obtained by the judicious choice of filler. For electrically conducting adhesives, the fillers range from silver flake to silver-coated fibers. For thermally conducting adhesives, the fillers range from aluminum oxide to boron nitride. We also discuss a specific type of electrically conducting adhesive–the z-axis film adhesive. In these adhesives, particles are oriented in such a fashion that allows conduction in the direction perpendicular to the adhesive, but not in the plane of the adhesive.