Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Luzinov, Igor
Minko, Sergiy
and
Tsukruk, Vladimir V
2004.
Adaptive and responsive surfaces through controlled reorganization of interfacial polymer layers.
Progress in Polymer Science,
Vol. 29,
Issue. 7,
p.
635.
Inoue, M.
Miyamoto, T.
and
Suganuma, K.
2004.
Analysis of influential factors in determining adhesive strength of ACF joints.
p.
148.
Inoue, Masahiro
and
Suganuma, Katsuaki
2005.
Effect of curing conditions on the interconnect properties of isotropic conductive adhesives composed of an epoxy-based binder.
p.
1.
Cristescu, R.
Patz, T.
Narayan, R.J.
Menegazzo, N.
Mizaikoff, B.
Mihaiescu, D.E.
Messersmith, P.B.
Stamatin, I.
Mihailescu, I.N.
and
Chrisey, D.B.
2005.
Processing of mussel adhesive protein analog thin films by matrix assisted pulsed laser evaporation.
Applied Surface Science,
Vol. 247,
Issue. 1-4,
p.
217.
Patz, T.
Cristescu, R.
Narayan, R.
Menegazzo, N.
Mizaikoff, B.
Messersmith, P.B.
Stamatin, I.
Mihailescu, I.N.
and
Chrisey, D.B.
2005.
Processing of mussel-adhesive protein analog copolymer thin films by matrix-assisted pulsed laser evaporation.
Applied Surface Science,
Vol. 248,
Issue. 1-4,
p.
416.
Inoue, Masahiro
and
Suganuma, Katsuaki
2005.
Test speed dependency of peel strength of ACF joints.
p.
1.
Inoue, M.
Muta, H.
Maekawa, T.
Yamanaka, S.
and
Suganuma, K.
2006.
Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder.
p.
236.
Yi Li
Kyoung-sik Moon
and
Wong, C.P.
2006.
Novel Nanotechnology for Environmentally Friendly Interconnect Materials in Microelectronic Packaging Applications.
p.
32.
Yi Li
and
Wong, C.P.
2006.
Silver migration control in electrically conductive adhesives.
p.
206.
Li, Yi
and
Wong, C.P.
2006.
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications.
Materials Science and Engineering: R: Reports,
Vol. 51,
Issue. 1-3,
p.
1.
Li, Yi
Moon, Kyoung-Sik
Whitman, Andrew
and
Wong, C. P.
2006.
Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes.
IEEE Transactions on Components and Packaging Technologies,
Vol. 29,
Issue. 4,
p.
758.
Yi Li
Kyoung-sik Moon
and
Wong, C.P.
2006.
Novel Lead Free Nano-scale Non-Conductive Adhesive (NCA) for Ultra-Fine Pitch Interconnect Applications.
p.
1239.
Li, Yi
Xiao, Fei
Moon, Kyoung‐Sik
and
Wong, C. P.
2006.
Novel curing agent for lead‐free electronics: Amino acid.
Journal of Polymer Science Part A: Polymer Chemistry,
Vol. 44,
Issue. 2,
p.
1020.
Wang, T.
Lei, C.‐H.
Dalton, A. B.
Creton, C.
Lin, Y.
Fernando, K. A. S.
Sun, Y.‐P.
Manea, M.
Asua, J. M.
and
Keddie, J. L.
2006.
Waterborne, Nanocomposite Pressure‐Sensitive Adhesives with High Tack Energy, Optical Transparency, and Electrical Conductivity.
Advanced Materials,
Vol. 18,
Issue. 20,
p.
2730.
Li, Y.
and
Wong, C.P.
2006.
A novel non-migration nano-ag conductive adhesive with enhanced electrical and thermal properties via self-assembled monolayers modification.
p.
924.
Kim, Jin Kon
Kim, Jong Won
Kim, Myung Im
and
Song, Min Seok
2006.
Thermal conductivity and adhesion properties of thermally conductive pressure-sensitive adhesives.
Macromolecular Research,
Vol. 14,
Issue. 5,
p.
517.
Bailey, Christopher
Inoue, Masahiro
and
Suganuma, Katsuaki
2006.
Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder.
Soldering & Surface Mount Technology,
Vol. 18,
Issue. 2,
p.
40.
Inoue, Masahiro
Muta, Hiroaki
Yamanaka, Shinsuke
and
Suganuma, Katsuaki
2007.
Temperature Dependence of Electrical Resistivity of Isotropic Conductive Adhesive Composed of An Epoxy-based Binder.
p.
1.
Li, Yi
Xiao, Fei
and
Wong, C. P.
2007.
Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: Tryptophan‐cured diglycidyl ether of bisphenol A epoxy.
Journal of Polymer Science Part A: Polymer Chemistry,
Vol. 45,
Issue. 2,
p.
181.
Inoue, Masahiro
and
Suganuma, Katsuaki
2007.
The Dependence on Thermal History of the Electrical Properties of an Epoxy-Based Isotropic Conductive Adhesive.
Journal of Electronic Materials,
Vol. 36,
Issue. 6,
p.
669.