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Effect of Zn content on interfacial reactions of Ni/Sn–xZn/Ni joints under temperature gradient

Published online by Cambridge University Press:  29 August 2017

Ning Zhao ,
Jianfeng Deng ,
Yi Zhong ,
Haitao Ma ,
Yunpeng Wang  and
Ching-ping Wong
Ning Zhao*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Jianfeng Deng
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Yi Zhong
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Haitao Ma*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Yunpeng Wang
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Ching-ping Wong
Affiliation:
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
*
a) Address all correspondence to these authors. e-mail: [email protected]
b) e-mail: [email protected]
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Abstract

Ni/Sn–xZn/Ni (x = 1, 5, 9 wt%) joints were used to investigate the effect of Zn content on interfacial reactions during reflow under a temperature gradient. Asymmetrical growth and transformation of intermetallic compounds (IMCs) occurred between the cold and hot end interfaces. Faster IMC growth at the cold end and a more prompt IMC transformation at the hot end in a lower Zn content solder joint were identified due to the more thermomigration-induced Zn and Ni atomic fluxes toward the cold end. The main diffusion species into IMC layers changed from Zn atoms at the early stage to Sn and Ni atoms at the later stage. As a result, the IMC evolution followed (Ni,Zn)3Sn4 → Ni3Sn4 in the Ni/Sn–1Zn/Ni joint, Ni5Zn21 → τ phase → Ni3Sn4 in the Ni/Sn–5Zn/Ni joint, and Ni5Zn21 → τ phase in the Ni/Sn–9Zn/Ni joint along with the reflow time. A higher Zn content could effectively inhibit the dissolution of the hot-end Ni substrate and restrain the growth rate of the cold-end interfacial IMCs.

Keywords

electronic materialpackagingsoldering
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 18 , 28 September 2017 , pp. 3555 - 3563
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Copyright
Copyright © Materials Research Society 2017 

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Footnotes

Contributing Editor: Jürgen Eckert

A previous error in this article has been corrected, please see doi: 10.1557/jmr.2017.379.

References

REFERENCES

Chen, C., Hsiao, H.Y., Chang, Y.W., Ouyang, F.Y., and Tu, K.N.: Thermomigration in solder joints. Mater. Sci. Eng., R 73, 85–100 (2012).CrossRefGoogle Scholar
Zhong, Y., Huang, M.L., Ma, H.T., Dong, W., Wang, Y.P., and Zhao, N.: In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient. J. Mater. Res. 31, 609–617 (2016).Google Scholar
Zhao, N., Zhong, Y., Dong, W., Huang, M.L., Ma, H.T., and Wong, C.P.: Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect. Appl. Phys. Lett. 110, 093504 (2017).Google Scholar
Guo, M.Y., Lin, C.K., Chen, C., and Tu, K.N.: Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints. Intermetallics 29, 155–158 (2012).CrossRefGoogle Scholar
Ouyang, F.Y., Jhu, W.C., and Chang, T.C.: Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits. J. Alloys Compd. 580, 114–119 (2013).Google Scholar
Hsiao, H.Y. and Chen, C.: Thermomigration in Pb-free SnAg solder joint under alternating current stressing. Appl. Phys. Lett. 94, 092107 (2009).CrossRefGoogle Scholar
Pandey, P., Tiwary, C.S., and Chattopadhyay, K.: Effects of minute addition of Ni on microstructure and mechanical properties of Sn–Zn eutectic alloy. J. Electron. Mater. 45, 5468–5477 (2016).Google Scholar
Liu, J.C., Zhang, G., Ma, J.S., and Suganuma, K.: Ti addition to enhance corrosion resistance of Sn–Zn solder alloy by tailoring microstructure. J. Alloys Compd. 644, 113–118 (2015).Google Scholar
Yang, Y.S., Yang, C.J., and Ouyang, F.Y.: Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration. J. Alloys Compd. 674, 331–340 (2016).Google Scholar
Chou, C.Y., Chen, S.W., and Chang, Y.S.: Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples. J. Mater. Res. 21, 1849–1856 (2006).CrossRefGoogle Scholar
Ho, C.E., Yang, S.C., and Kao, C.R.: Interfacial reaction issues for lead-free electronic solders. J. Mater. Sci.: Mater. Electron. 18, 155–174 (2007).Google Scholar
Wang, C.H. and Chen, H.H.: Study of the effects of Zn content on the interfacial reactions between Sn–Zn solders and Ni substrates at 250 °C. J. Electron. Mater. 39, 2375–2381 (2010).CrossRefGoogle Scholar
Wang, C.H., Chen, H.H., and Lai, W.H.: Effects of minor amounts of Zn on the Sn–Zn/Ni interfacial reactions and phase equilibria of the ternary Sn–Zn–Ni system at 250 °C. J. Electron. Mater. 40, 2436–2444 (2011).Google Scholar
Zhu, W.J., Liu, H.S., Wang, J.S., Ma, G., and Jin, Z.P.: Interfacial reactions between Sn–Zn alloys and Ni substrates. J. Electron. Mater. 39, 209–214 (2010).CrossRefGoogle Scholar
Li, Q.Q., Chan, Y.C., Zhang, K.L., and Yung, K.C.: Study of microstructure evolution in novel Sn–Zn/Cu bi-layer and Cu/Sn–Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection. Microelectron. Eng. 122, 52–58 (2014).Google Scholar
Jao, C.C., Yen, Y.W., Lin, C.Y., and Lee, C.: Phase equilibria of the Sn–Zn–Ag system and interfacial reactions in Sn–Zn/Ag couples. Intermetallics 16, 463–469 (2008).Google Scholar
Zhong, Y., Zhao, N., Ma, H.T., Dong, W., and Huang, M.L.: Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition. J. Alloys Compd. 695, 1436–1443 (2017).CrossRefGoogle Scholar
Zhao, N., Deng, J.F., Zhong, Y., Huang, M.L., and Ma, H.T.: Abnormal intermetallic compound evolution in Ni/Sn/Ni and Ni/Sn–9Zn/Ni micro solder joints under thermomigration. J. Electron. Mater. 46, 1391–1396 (2017).CrossRefGoogle Scholar
Zhao, N., Zhong, Y., Huang, M.L., Ma, H.T., and Dong, W.: Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient. Sci. Rep. 5, 13491 (2015).Google Scholar
Chen, S.W., Hsu, C.M., Chou, C.Y., and Hsu, C.W.: Isothermal section of ternary Sn–Zn–Ni phase equilibria at 250 °C. Prog. Nat. Sci.: Mater. Int. 21, 386–391 (2011).CrossRefGoogle Scholar
Chen, W.M., Yang, S.C., Tsai, M.H., and Kao, C.R.: Uncovering the driving force for massive spalling in the Sn–Cu/Ni system. Scr. Mater. 63, 47–49 (2010).CrossRefGoogle Scholar
Chiu, M.Y., Wang, S.S., and Chuang, T.H.: Intermetallic compounds formed during interfacial reactions between liquid Sn–8Zn–3Bi solders and Ni substrates. J. Electron. Mater. 31, 494–499 (2002).Google Scholar
Zhao, N., Zhong, Y., Huang, M.L., Dong, W., Wang, Y.P., and Ma, H.T.: In situ study on interfacial reactions of Cu/Sn–9Zn/Cu solder joints under temperature gradient. J. Alloys Compd. 682, 1–6 (2016).CrossRefGoogle Scholar
Zhao, N., Zhong, Y., Huang, M.L., Ma, H.T., and Dong, W.: Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient. Intermetallics 79, 28–34 (2016).Google Scholar