Systematic investigations were performed of the thickness dependences of the thermoelectric properties of PbSe thin films, freshly prepared and exposed to air at room temperature. It is shown that oxidation leads to a sharp change in the thermoelectric properties of the PbSe films including a change in the sign of the dominant carrier type from n-type to p- type at d ≤ 80 nm. Using a two carrier model for thin films (d < 50 nm) and a two-layer model for thick films (d > 50 nm) allows us to give a satisfactory qualitative interpretation of the observed experimental dependences of the thermoelectric properties on the film thickness.

Half-Heusler alloys are currently being investigated for their potential as thermoelectric materials [1], [2]. They exhibit high negative thermopower (40-250μV/K) and favorable electrical resistivity (0.1-8mW•cm) at room temperature. Attractive power factors (α2σT) of about (0.2-1.0W/m•K) at room temperature and about 4W/m•K at 600K [3] have been reported in these materials. But in order to achieve a high figure-of-merit in the half-Heusler alloys, the relatively high thermal conductivity in these materials (∼ 10 W/m•K) must be reduced. The thermal conductivity in these materials is composed of mainly a lattice contribution, compared to a very small electronic component. The challenge is to reduce the relatively high lattice thermal conductivity in these materials. Reported in this paper is a significant reduction of lattice thermal conductivity (∼1.5 - 3.5W/m•K) in some Ti-based half-Heusler alloys. Samples have been prepared by ball milling and followed by shock-compaction that has resulted into reduced grain sizes in these materials. The effects of the microstructure on the thermal transport properties of the Half-Heusler alloys have been investigated and are presented and discussed herein.

Thin film thermionic coolers use selective emission of hot electrons over a heterostructure barrier layer from emitter to collector resulting in evaporative cooling. In this paper a detailed theory of electron transport perpendicular to the multilayer superlattice structures is presented. Using Fermi-Dirac statistics, density-of-states for a finite quantum well and the quantum mechanical reflection coefficient, the currentvoltage characteristics and the cooling power density are calculated. The resulting equations are valid in a wide range of temperatures and electric fields. It is shown that conservation of lateral momentum plays an important role in the device characteristics. If the lateral momentum of the hot electrons is conserved in the thermionic emission process, only carriers with sufficiently large kinetic energy perpendicular to the barrier can pass over it and cool the emitter junction. However, if there is no conservation of lateral momentum, the number of electrons participating in thermionic emission will dramatically increase. The theoretical calculations are compared with the experimental dark current characteristics of quantum well infrared photodetectors and good agreement over a wide temperature range is obtained. Calculations for InGaAs/InGaAsP superlattice structures show that the effective thermoelectric power factor (electrical conductivity times the square of the effective Seebeck coefficient) can be improved comparing to that of bulk material. We will also discuss methods by which the conservation of lateral momentum in thermionic emission process can be altered such as by creating a controlled roughness at the interface of the superlattice barriers. The improvement in the effective power factor through thermionic emission can be combined with the other methods to reduce the phonon thermal conductivity in superlattices and thus obtain higher thermoelectric figure-of-merit ZT.