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Thin Film Stress in Metal/Ceramic Microlaminates

Published online by Cambridge University Press:  15 February 2011

R. B. Inturi ,
J. A. Barnard ,
M. Chinmulgund  and
J. D. Jarratt
R. B. Inturi
Affiliation:
The University of Alabama, Department of Metallurgical and Materials Engineering, Tuscaloosa, AL 35487-0202
J. A. Barnard
Affiliation:
The University of Alabama, Department of Metallurgical and Materials Engineering, Tuscaloosa, AL 35487-0202
M. Chinmulgund
Affiliation:
The University of Alabama, Department of Metallurgical and Materials Engineering, Tuscaloosa, AL 35487-0202
J. D. Jarratt
Affiliation:
The University of Alabama, Department of Metallurgical and Materials Engineering, Tuscaloosa, AL 35487-0202
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Abstract

Al/SiC multilayer microlaminates grown by sequential deposition of sputtered Al and SiC layers were used as a model system to study stress and mechanical properties of metal-matrix composites. The average stress in as-deposited and annealed microlaminates was determined as a function of laminate geometry. Film stress tends to approach constant values for increasing Al layer thickness, large numbers of bilayers, and high layer densities. Microlaminates with thin Al and SiC layers showed purely elastic deformation in σ -T tests to 400ºC. Even though the total measured film stress in a microlaminate geometry exhibited deviations from a simple rule of mixtures, the rate of change of stress with temperature in a microlaminate in the elastic region equals the sum of the slopes obtained separately from each of the individual layers.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 719
Copyright
Copyright © Materials Research Society 1993

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References

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