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Thin Film Fine Line Work of Adhesion by Microwedge Indentation

Published online by Cambridge University Press:  21 February 2011

M. P. de Boer ,
N. R. Moody ,
H Huang  and
W.W. Gerberich
M. P. de Boer
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
N. R. Moody
Affiliation:
Sandia National Laboratory, Livermore, CA 94551
H Huang
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
W.W. Gerberich
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
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Abstract

The mechanics for plane strain geometry are presented for thin film fine lines by considering the case of microwedge indentation of a fine line subject to no residual stress. The analysis is separated into three parts depending on the absence or presence of buckling. During indentation, unbuckled or double-buckled configurations may exist, while single-buckling may occur when the indenter tip is removed. A microwedge tip was employed in the indentation testing of unstressed rf-sputtered tungsten fine lines to demonstrate some of the analysis.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 693
Copyright
Copyright © Materials Research Society 1995

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