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Stress and Electromigration

Published online by Cambridge University Press:  15 February 2011

J.R. Lloyd
J.R. Lloyd*
Affiliation:
Digital Equipment Corporation 77 Reed Road, Hudson MA 01749-2895
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Extract

The interdependence of mechanical stress and electromigration behavior has been recognized for quite some time, but has only begun to be fully appreciated and dealt with in a meaningful manner. There have been a number of recent advances in understanding that also may lead to a change in the way that electromigration failure is viewed in real applications.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 231
Copyright
Copyright © Materials Research Society 1995

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