Hostname: page-component-745bb68f8f-b95js Total loading time: 0 Render date: 2025-02-04T18:04:19.439Z Has data issue: false hasContentIssue false
  • English
  • Français

Microhardness of Thin SIO2 Films On Silicon.

Published online by Cambridge University Press:  26 February 2011

B. Yost ,
Che-Yu Li ,
Bette Bergman-Reuter  and
Tim Sullivan
B. Yost
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
Che-Yu Li
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
Bette Bergman-Reuter
Affiliation:
IBM Corporation, 1000 River St., Essex Junction, VT 05452
Tim Sullivan
Affiliation:
IBM Corporation, 1000 River St., Essex Junction, VT 05452
Get access

Abstract

Hardness properties of CVD SiO2, films deposited on silicon substrates are investigated by microindentation techniques. It is found that the hardness of these films is sensitive to the thermal histories and doping and is less influenced by the residual stress levels.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 225
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] , LaFontaine, William, R. Deformation Properties of Thin Metallic Films Deposited on Hard Substrates, PhD Thesis, Cornell University May 1990.Google Scholar
[2] LaFontaine, W. R., Yost, B., Black, R. D., and Li, C.-Y.. “Indentation load relaxation experiments with indentation depth in the submicron range”, Journal of Materials Research 5 (10) 2100–2106 1990.Google Scholar
[3] Korhonen, M. A., Black, R. D., and Li, Che-Yu. “Stress Relaxation of Passivated Aluminum Line Metallizations on Silicon Substrates”, Journal of Applied Physics, January 1991.Google Scholar
[4] Antis, G. R., Chantikul, P., Lawn, B. R., and Marshall, D. B.. “A Critical Evaluation of Indentation Techniques for Measuring Fracture Toughness: I, Direct Crack Measurements”, Journal of the American Ceramics Society 64 [9], 533–538 1990.Google Scholar
[5] Ponton, C. B. and Rawlings, R. D.. “Vickers Indentation Fracture Toughness Test Part 1 Review of Literature and Formulation of Standardized Indentation Toughness Equations”, Material Science and Technology 5 September 1989 865–871.Google Scholar
[6] Cornett, Kenneth D., Fabes, B. D., and Oliver, W. C.. “Mechanical Properties of Silica Coatings”, Materials Research Society Proceedings 188, 133–138, 1990 Google Scholar
[7] Cook, Robert F. and Pharr, George M.. “Direct Observation and Analysis of Indentation Cracking in Glasses and Ceramics”, Journal of the American Ceramics Society 73 [4] 787–817 1990.Google Scholar