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Mechanical Stress Effects on Electromigration Voiding in a Meandering Test Stripe

Published online by Cambridge University Press:  15 February 2011

Lynn E. Lowry ,
Beverly H. Tai ,
J. Mattila  and
LH. Walsh
Lynn E. Lowry
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, Pasadena, CA 91109
Beverly H. Tai
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, Pasadena, CA 91109
J. Mattila
Affiliation:
Rome Laboratory, Griffiss AFB, NY.
LH. Walsh
Affiliation:
Rome Laboratory, Griffiss AFB, NY.
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Abstract

Earlier experimental findings concluded that electromigration voids in these meandering stripe test structures were not randomly distributed and that void nucleation frequently occurred sub-surface at the metal/thermal oxide interface. The data showed a strong correlation between void area, void growth rate and stripe segment length [1]. The influence of mechanical stress on electromigration damage in these test structures has been examined by applying tensile stresses to both passivated and unpassivated samples. The stress distributions are calculated using finite element analysis for each of the test conditions. The resulting impact on electromigration voiding, as well as mechanical stress voiding, and lateral hillock formation is discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 273
Copyright
Copyright © Materials Research Society 1993

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References

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