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Finite Element Analysis of Electromigration and Stress Induced Diffusion in Deformable Solids

Published online by Cambridge University Press:  15 February 2011

A.F. Bower  and
L.B. Freund
A.F. Bower
Affiliation:
Division of Engineering, Brown University, Providence, RI 02912
L.B. Freund
Affiliation:
Division of Engineering, Brown University, Providence, RI 02912
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Abstract

With a view to analyzing failure mechanisms in interconnects, we have developed a finite element method that may be used to compute the effects of diffusion and deformation in an electrically conducting, deformable solid. The analysis accounts for large changes in the shape of the solid due to surface diffusion, grain boundary diffusion, and elastic or inelastic deformation within the grains. To illustrate the capabilities of the method, we have analyzed void migration and collapse due to current induced surface diffusion; the drift of a strip of conducting solid on a substrate; and have calculated intergranular stresses and plastic deformation induced by electromigration in a passivated, polycrystalline interconnect line.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 177
Copyright
Copyright © Materials Research Society 1995

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