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Elastic, Transversely Isotropic Film Indented by a Punch; Application to Multilayered Thin Films

Published online by Cambridge University Press:  21 February 2011

D.S. Stone
D.S. Stone*
Affiliation:
Department of Materials Science and Engineering, University of Wisconsin, 1509 University Ave, Madison, WI 53706
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Abstract

A model calculates the compliance of elastic contact between a punch and bilayer, the latter consisting of a transversely isotropic film on top of isotropic substrate. Used in data analysis, the model helps estimate the Young’s modulus of amorphous silicon (100±20 GPa) layers within amorphous silicon/aluminum multilayer composites deposited on silicon.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 687
Copyright
Copyright © Materials Research Society 1995

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