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Composites for Electronic Substrate Applications
Published online by Cambridge University Press: 21 February 2011
Abstract
The need for low dielectric constant, high thermal conductivity, matched thermal expansion and co-processability in electronic substrates is reviewed. Since no single phase material is able to satisfy all the requirements, a microscopic composite approach is proposed. Recent experimental evidence supporting the concept is also presented.
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- Research Article
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- Copyright © Materials Research Society 1988
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