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Million-Line Failure Distributions for Narrow Interconnects

Published online by Cambridge University Press:  10 February 2011

M. C. Bartelt ,
J. J. Hoyt ,
N. C. Bartelt ,
J. J. Dike  and
W. G. Wolfer
M. C. Bartelt
Affiliation:
Computational Materials Science Department
J. J. Hoyt
Affiliation:
Computational Materials Science Department
N. C. Bartelt
Affiliation:
Computational Materials Science Department
J. J. Dike
Affiliation:
Solid and Material Mechanics Department, Sandia National Laboratories, Livermore, CA 94550
W. G. Wolfer
Affiliation:
Computational Materials Science Department
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Abstract

We examine the distribution of failure times in a simple and computationally efficient, yet reasonably authentic, model of interconnect reliability that allows consideration of statistically significant samples. The model includes an approximate description of the distribution of grain sizes and texture in narrow interconnects, an effective treatment of stress evolution associated with mass transport along grain boundaries, and local relaxation of stresses due to void formation. Failure time distributions for populations of idealized structures are analyzed to aid in interpretation of model behavior.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 505 , 1997 , 123
Copyright
Copyright © Materials Research Society 1998

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References

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