Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Hara, Kazukuni
Naito, Masami
Fujibayashi, Hiroaki
Akiba, Atsuya
Takeuchi, Yuuichi
Milikofu, Olga
and
Kozu, Tomomi
2015.
3D Raman Spectroscopy Investigation of Defects in 4H-SiC Epilayer.
Materials Science Forum,
Vol. 821-823,
Issue. ,
p.
339.
Batten, Tim
and
Milikofu, Olga
2015.
Characterising Strain/Stress and Defects in SiC Wafers Using Raman Imaging.
Materials Science Forum,
Vol. 821-823,
Issue. ,
p.
229.
Sakakima, Hiroki
Takamoto, So
Murakami, Yoichi
Hatano, Asuka
Goryu, Akihiro
Hirohata, Kenji
and
Izumi, Satoshi
2018.
Development of a method to evaluate the stress distribution in 4H-SiC power devices.
Japanese Journal of Applied Physics,
Vol. 57,
Issue. 10,
p.
106602.
Yang, Xu
Yang, Xiaozhe
Kawai, Kentaro
Arima, Kenta
and
Yamamura, Kazuya
2019.
Highly efficient planarization of sliced 4H–SiC (0001) wafer by slurryless electrochemical mechanical polishing.
International Journal of Machine Tools and Manufacture,
Vol. 144,
Issue. ,
p.
103431.
Fu, Wei
Kobayashi, Ai
Yano, Hiroshi
Ueda, Akiko
Harada, Shinsuke
and
Sakurai, Takeaki
2019.
Investigation of stress at SiO2/4H-SiC interface induced by thermal oxidation by confocal Raman microscopy.
Japanese Journal of Applied Physics,
Vol. 58,
Issue. SB,
p.
SBBD03.
Arora, Aman
Pandey, Akhilesh
Patel, Ankit
Dalal, Sandeep
Yadav, Brajesh S.
Goyal, Anshu
Raman, R.
Thakur, O. P.
and
Tyagi, Renu
2020.
Polytype switching identification in 4H-SiC single crystal grown by PVT.
Journal of Materials Science: Materials in Electronics,
Vol. 31,
Issue. 19,
p.
16343.
Sugiyama, Naohiro
Mitani, Takeshi
Kamata, Isaho
Kato, Tomohisa
Tsuchida, Hidekazu
and
Okumura, Hajime
2020.
Formation of Double Shockley Stacking Faults in Heavily Nitrogen Doped 4H-SiC Crystal with Reduction of Residual Stress around Scratch Damage.
Materials Science Forum,
Vol. 1004,
Issue. ,
p.
427.
Yang, Xiaozhe
Yang, Xu
Kawai, Kentaro
Arima, Kenta
and
Yamamura, Kazuya
2021.
Dominant factors and their action mechanisms on material removal rate in electrochemical mechanical polishing of 4H-SiC (0001) surface.
Applied Surface Science,
Vol. 562,
Issue. ,
p.
150130.
Breev, I. D.
Likhachev, K. V.
Yakovleva, V. V.
Veishtort, I. P.
Skomorokhov, A. M.
Nagalyuk, S. S.
Mokhov, E. N.
Astakhov, G. V.
Baranov, P. G.
and
Anisimov, A. N.
2021.
Effect of Mechanical Stress on the Splitting of Spin Sublevels in 4H-SiC.
JETP Letters,
Vol. 114,
Issue. 5,
p.
274.
Breev, I. D.
Poshakinskiy, A. V.
Yakovleva, V. V.
Nagalyuk, S. S.
Mokhov, E. N.
Hübner, R.
Astakhov, G. V.
Baranov, P. G.
and
Anisimov, A. N.
2021.
Stress-controlled zero-field spin splitting in silicon carbide.
Applied Physics Letters,
Vol. 118,
Issue. 8,
Yang, Xu
Yang, Xiaozhe
Kawai, Kentaro
Arima, Kenta
and
Yamamura, Kazuya
2021.
Novel SiC wafer manufacturing process employing three-step slurryless electrochemical mechanical polishing.
Journal of Manufacturing Processes,
Vol. 70,
Issue. ,
p.
350.
Breev, I. D.
Likhachev, K. V.
Yakovleva, V. V.
Hübner, R.
Astakhov, G. V.
Baranov, P. G.
Mokhov, E. N.
and
Anisimov, A. N.
2021.
Stress distribution at the AlN/SiC heterointerface probed by Raman spectroscopy.
Journal of Applied Physics,
Vol. 129,
Issue. 5,
Yang, Xiaozhe
Yang, Xu
Gu, Haiyang
Kawai, Kentaro
Arima, Kenta
and
Yamamura, Kazuya
2022.
Efficient and slurryless ultrasonic vibration assisted electrochemical mechanical polishing for 4H–SiC wafers.
Ceramics International,
Vol. 48,
Issue. 6,
p.
7570.
Steiner, Johannes
and
Wellmann, Peter J.
2022.
Impact of Mechanical Stress and Nitrogen Doping on the Defect Distribution in the Initial Stage of the 4H-SiC PVT Growth Process.
Materials,
Vol. 15,
Issue. 5,
p.
1897.
Zhang, Ruihao
Wang, Bing
Liu, Zhanqiang
Jiang, Liping
Cai, Yukui
and
Song, Qinghua
2023.
Strain rate effect on material deformation and removal behavior during high speed scratching of 4H‐SiC.
Tribology International,
Vol. 187,
Issue. ,
p.
108756.
Strüber, Sven
Arzig, Matthias
Steiner, Johannes
Salamon, Michael
Uhlmann, Norman
and
Wellmann, Peter J.
2023.
Investigation of the Nucleation Process during the Initial Stage of PVT Growth of 4H-SiC.
Solid State Phenomena,
Vol. 343,
Issue. ,
p.
51.
Yang, Xu
Yang, Xiaozhe
Aoki, Kazufumi
and
Yamamura, Kazuya
2023.
Slurryless electrochemical mechanical polishing of 4-inch 4H–SiC (0001) and (000–1) surfaces.
Precision Engineering,
Vol. 83,
Issue. ,
p.
237.
Yang, Xiao Li
Pan, Ya Ni
Gao, Chao
Liang, Qing Rui
Wang, Lu Ping
Zhang, Jiu Yang
Gao, Yu Han
Ning, Xiu Xiu
and
Zhang, Hong Yan
2023.
Development of High Quality 8 Inch 4H-SiC Substrates.
Solid State Phenomena,
Vol. 344,
Issue. ,
p.
41.
Yang, Zhoudong
Wang, Xinyue
Zuo, Yuanhui
Tang, Zhuorui
Guo, Baotong
Zhang, Junran
Tang, Hongyu
Zhang, Rongjun
Fan, Xuejun
Zhang, Guoqi
and
Fan, Jiajie
2024.
Prediction of Temperature‐Dependent Stress in 4H‐SiC Using In Situ Nondestructive Raman Spectroscopy Characterization.
Laser & Photonics Reviews,
Wu, Zhe
Zhang, Yuqi
Wang, Chengwu
Liu, Yong
Li, Haoxiang
Yuan, Julong
and
Liu, Zhifeng
2024.
High-efficiency green machining of single crystal 4H–SiC based on tribo-oxidation.
Ceramics International,
Vol. 50,
Issue. 14,
p.
26149.