Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-12-01T01:15:53.369Z Has data issue: false hasContentIssue false

Commercial MEMS Case Studies: The Impact of Materials, Processes and Designs

Published online by Cambridge University Press:  01 February 2011

Jack Martin*
Affiliation:
[email protected]@comcast.net, United States
Get access

Abstract

Minimizing risk is an important factor in new product planning because high volume breakthrough products require tens of millions of dollars to develop and bring to market. Sometimes risk can be minimized by following the IC model: build new devices on an existing process – just change the mask set. This approach obviously has limits. Adoption of new materials and processes greatly expands the horizon for “disruptive” products. This paper uses a case study approach to examine how changes in masks, materials and unit processes were used, and will continue to be used, to produce MEMS products for high volume applications.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Angell, J. B., Terry, S. C., and Barth, P. W., Scientific American, 248 (4), 44 (1983).Google Scholar
2. Majumder, S., Lampen, J., Morrison, R. and Maciel, J., Microwave Symp. Digest, 3, 19351938 (2003).Google Scholar
3. Lindenberger, W. S., Poteat, T. L., and West, J. E., U.S.Patent No. 4 524 247 (18 June 1985).Google Scholar
4. Baumhauer, J. C., Hershey, H. J., and Poteat, T. L., U. S.Patent No. 4 533 795 (6 August 1985).Google Scholar
5. Busch-Vishniac, I. J., Lindenberger, W. S., Lynch, W. T., and Poteat, T. O., U. S.Patent No. 4 558 184 (10 December 1985).Google Scholar
6. Anon, Micronews, 53, (Yole Développement SARL, Lyon, December 2006) p. 9.Google Scholar
7. Martin, J. R., U.S.Patent No. 6 358 771 (19 March 2002).Google Scholar
8. Potin, M., Micronews, 68, (Yole Développement SARL, Lyon, April 2008) pp. 67.Google Scholar
9. Martin, J., Proc. SPIE, 6463, Reliability, Packaging, Testing and Characterization of MEMS/MOEMS VI, edited by Hartzell, A. and Ramesham, R. (SPIE, Bellingham, 2007) p. 64630M.Google Scholar
10. Yun, C. H., Martin, J. R., Chen, L. and Frey, T. J., ECS Transactions, 16 (8), 117124 (2008).Google Scholar
11. Martin, J. R. in Nanotribology: Critical Assessment and Research Needs, edited by Hsu, S. M. and Ying, Z. C. (Kluwer, Dordrecht, 2002) ch. 14.Google Scholar
12. Martin, J. R. in Handbook of NAnotechnology (2nd ed), edited by Bhushan, B. (Springer-Verlag, Berlin, 2007) ch. 55.Google Scholar
13. Martin, J. R., U.S.Patent No. 7 364 942 (29 April 2008).Google Scholar