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Characteristics of Lateral Capacitor Based on High-K Materials

Published online by Cambridge University Press:  01 February 2011

Thottam Kalkur
Affiliation:
[email protected], University of Colorado at Colorado Springs, Department of Electrical and Computer Engineering, 1420, Austin Bluff Parkway, Colorado Springs, 80933-7150, United States
Mark Azadpour
Affiliation:
[email protected], West Carolina University, Cullowhee, 28723, United States
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Abstract

In order to take advantage of continued interconnect scaling dimensions in very large scale integrated circuit technology, lateral capacitors with BST dielectric have been proposed. The lateral capacitors have been implemented by platinum/titanium metallization patterned by standard photolithographic techniques and ion-milling. The high-K dielectric BST has been deposited by spin-on MOD and radio frequency magnetron sputtering. The capacitance of lateral capacitor was found to increase with increase in thickness of BST and annealing temperature. The negative temperature dependence capacitance above room temperature shows that BST is in para-electric phase.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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