Nanostructured Copper Achieves Simultaneous High Strength and Ductility

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Type: Research/Researchers
Information: MRS Bulletin , Volume 28 , Issue 1: Microelectronics Packaging and Integration , January 2003 , pp. 4

DOI: https://doi.org/10.1557/mrs2003.4 [Opens in a new window]

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Nanostructured Copper Achieves Simultaneous High Strength and Ductility

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Nanostructured Copper Achieves Simultaneous High Strength and Ductility

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