Nanostructured Copper Achieves Simultaneous High Strength and Ductility

Kinson C. Kam

doi:10.1557/mrs2003.4

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Nanostructured Copper Achieves Simultaneous High Strength and Ductility

Published online by Cambridge University Press: 31 January 2011

Kinson C. Kam

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Type: Research/Researchers
Information: MRS Bulletin , Volume 28 , Issue 1: Microelectronics Packaging and Integration , January 2003 , pp. 4

DOI: https://doi.org/10.1557/mrs2003.4 [Opens in a new window]
Copyright: Copyright © Materials Research Society 2003

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Nanostructured Copper Achieves Simultaneous High Strength and Ductility

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