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Study of growth kinetics in melt-textured YBa2Cu3O7−x

Published online by Cambridge University Press:  31 January 2011

Srinath P. Athur
Affiliation:
Texas Center for Superconductivity and Department of Mechanical Engineering, University of Houston, Houston, Texas 77204
V. Selvamanickam
Affiliation:
Intermagnetics General Corporation, Latham, New York
U. Balachandran
Affiliation:
Energy Technology Division, Argonne National Laboratory, Argonne, Illinois 60439
K. Salama
Affiliation:
Texas Center for Superconductivity and Department of Mechanical Engineering, University of Houston, Houston, Texas 77204
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Abstract

Directional solidification has been shown to be a successful way of achieving high current densities in bulk YBCO. The lack of understanding of the growth kinetics, however, makes it difficult to fabricate longer samples and reduce the processing times. To study the growth kinetics, quenching experiments of undoped YBa2Cu3O7−x (Y-123) and Y-123 doped with Pt and Nd from above the peritectic temperature with different holding times, t, were conducted. The results of these experiments indicate that the average 211 particle size varies at t1/3. Growth rate experiments were also conducted on these samples to determine the maximum growth rate for plane front solidification, Rmax. This quantity was measured for undoped and doped Y-123, and it was found that the addition of Pt did not increase Rmax while the addition of Nd doubled the growth rate. Using the coarsening results together with the growth rate experiments, the diffusivity of Y in liquid and the 211-liquid interfacial energy for undoped and doped Y-123 were calculated.

Type
Articles
Copyright
Copyright © Materials Research Society 1996

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References

REFERENCES

1.Jin, S., Tiefel, T.H., Sherwood, R.C., van Dover, R.B., Davis, M.E., Kamlott, G.W., and Fastnacht, R.A., Phys. Rev. B 37, 7850 (1988).CrossRefGoogle Scholar
2.Salama, K., Selvamanickam, V., Gao, L., and Sun, K., Appl. Phys. Lett. 64, 2352 (1988).Google Scholar
3.Murakami, M., Modern Phys. Lett. B 4, 163 (1990).CrossRefGoogle Scholar
4.Selvamanickam, V., Partsinevelos, C., Mcguire, A.V., and Salama, K., Growth of Long Y–Ba–Cu–O Superconductors with High Current Density by a Modified Bridgman Method, Proc. ISTEC-MRS Conf. on Superconductivity, Honolulu (1992), p. 265.Google Scholar
5.McGinn, P.J., Chen, W., and Black, M.A., Physica C 161, 198 (1989).CrossRefGoogle Scholar
6.Izumi, T., Nakamura, Y., and Shiohara, Y., J. Mater. Res. 7, 1621 (1992).CrossRefGoogle Scholar
7.Cima, M.J., Flemings, M.C., Figuerado, A.M., Nakade, M., Ishii, H., Brody, H.D., and Haggerty, J.S., J. Appl. Phys. 72, 179 (1992).CrossRefGoogle Scholar
8.Lee, D.F., Selvamanickam, V., and Salama, K., Physica C 202, 83 (1992).CrossRefGoogle Scholar
9.Yoshida, , Ogawa, N., Hirabayashi, I., and Tanaka, S., Physica C. 185, 2409 (1991).CrossRefGoogle Scholar
10.Morita, M., Tanaka, M., Takebayashi, S., Kimura, K., Miyamoto, K., and Sawano, K., Jpn. J. Appl. Phys. 30, L813 (1991).CrossRefGoogle Scholar
11.Izumi, T., Nakamura, Y., and Shiohara, Y., J. Mater. Res. 8, 1240 (1993).CrossRefGoogle Scholar
12.Varanasi, C. and McGinn, P.J., J. Electron. Mater. 22, 1251 (1993).CrossRefGoogle Scholar
13.Griffith, M.L., Huffman, R.T., and Halloran, J.W., J. Mater. Res. 9, 1633 (1994).CrossRefGoogle Scholar
14.Flemings, M.C., Solidification Processing (McGraw-Hill, New York, 1974).CrossRefGoogle Scholar
15.St. John, D.H. and Hogan, L.M., Acta Metall. 25, 77 (1977).CrossRefGoogle Scholar
16.Titchener, A.P. and Spittle, J.A., Acta Metall. 23, 497 (1975).CrossRefGoogle Scholar
17.Greenwood, G. W., Acta Metall. 4, 243 (1956).Google Scholar
18.Maeda, M., Kadoi, M., and Ikeda, T., Jpn. J. Appl. Phys. 28, 1417 (1989).CrossRefGoogle Scholar
19.Kingery, W.D., Bowen, H.K., and Uhlmann, D.R., Introduction to Ceramics (John Wiley & Sons, New York, 1975).Google Scholar
20.Selvamanickam, V., Ph.D. Thesis, University of Houston (1992).Google Scholar
21. Private Communication with Dr. T. Y. Tien, Univ. of Michigan, Ann Arbor.Google Scholar