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Models for nanoindentation of compliant films on stiff substrates

Published online by Cambridge University Press:  11 June 2015

Yang Li
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
Pavan Valavala
Affiliation:
Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA
Supinda Watcharotone
Affiliation:
Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA
L. Catherine Brinson*
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA; and Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Nanoindentation is an effective approach for measuring mechanical properties of nanoscale films coated on substrates, yet results obtained through the classic Oliver–Pharr model require additional consideration due to the existence of a “substrate effect” when the film is much more compliant than the substrate. In this study, different models for removing this substrate effect are compared, with focus on the Gao model, the Saha–Nix model, and the Hay model and the use of a direct finite element (FE) approach is discussed. Validity of these models is examined using load–displacement data obtained from simulated indentation of an elastic–plastic film in FEs. It is found that the performance of the analytical models varies significantly with different testing parameters, including ratio between film modulus and substrate modulus (Ef/Es), indenting ratio (hmax/film thickness), and yield strain. Choices of using a nanoindentation model to process experimental data should be made according to estimated indentation depth and modulus difference between film and substrate. An example of applying substrate removal models to experimental data is also shown.

Type
Articles
Copyright
Copyright © Materials Research Society 2015 

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Footnotes

Contributing Editor: Susan B. Sinnott

References

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