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Influence of cold deformation and Ti element on the microstructure and properties of Cu–Cr system alloys

Published online by Cambridge University Press:  21 May 2015

Pengchao Zhang ,
Jinchuan Jie ,
Yuan Gao ,
Hang Li ,
Tongmin Wang  and
Tingju Li
Pengchao Zhang
Affiliation:
School of Materials Science and Engineering, Laboratory of Special Processing of Raw Materials, Dalian University of Technology, Dalian 116024, China
Jinchuan Jie*
Affiliation:
School of Materials Science and Engineering, Laboratory of Special Processing of Raw Materials, Dalian University of Technology, Dalian 116024, China
Yuan Gao
Affiliation:
School of Materials Science and Engineering, Laboratory of Special Processing of Raw Materials, Dalian University of Technology, Dalian 116024, China
Hang Li
Affiliation:
School of Materials Science and Engineering, Laboratory of Special Processing of Raw Materials, Dalian University of Technology, Dalian 116024, China
Tongmin Wang*
Affiliation:
School of Materials Science and Engineering, Laboratory of Special Processing of Raw Materials, Dalian University of Technology, Dalian 116024, China
Tingju Li
Affiliation:
School of Materials Science and Engineering, Laboratory of Special Processing of Raw Materials, Dalian University of Technology, Dalian 116024, China
*
a)Address all correspondence to these authors. e-mail: [email protected]
b)e-mail: [email protected]
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Abstract

The Cu–Cr system alloys with different Ti contents were prepared and processed by deformation and heat treatment. The microstructures, mechanical, and electrical properties were investigated under as-cast and aged conditions. The results indicate that the Cr precipitates present a dispersed distribution and exhibit a face-centered cubic (fcc) structure rather than equilibrium body-centered cubic (bcc) structure in the initial stage of aging. A certain amount of Ti atoms dissolves in matrix due to the large solid solubility, while the remaining atoms segregate around the interface of the Cr precipitates to form a sandwich structure. Improvement of mechanical properties is achieved with Ti addition and the increasing rolling reduction, which can be ascribed to multiple mechanisms. In addition, Ti has a negative effect on the electrical conductivity, while deformation has a slight effect on conductivity.

Keywords

Cu–Cr–Ti alloycold workingmicrostructuremechanical propertieselectrical properties
Type
Articles
Information
Journal of Materials Research , Volume 30 , Issue 13 , 14 July 2015 , pp. 2073 - 2080
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Raabe, D., Miyake, K., and Takahara, H.: Processing, microstructure, and properties of ternary high-strength Cu–Cr–Ag in situ composites. Mater. Sci. Eng., A 291, 186 (2000).CrossRefGoogle Scholar
Maki, K., Ito, Y., Matsunaga, H., and Mori, H.: Solid-solution copper alloys with high strength and high electrical conductivity. Scr. Mater. 68, 777 (2013).CrossRefGoogle Scholar
Takata, N., Lee, S.H., and Tsuji, N.: Ultrafine grained copper alloy sheets having both high strength and high electric conductivity. Mater. Lett. 63, 1757 (2009).CrossRefGoogle Scholar
Su, J.H., Liu, P., Dong, Q.M., Li, H.J., and Ren, F.Z.: Aging study of rapidly solidified and solid-solution Cu–Cr–Sn–Zn alloy. J. Mater. Process. Technol. 205, 366 (2008).CrossRefGoogle Scholar
Deng, J.Q., Zhang, X.Q., Shang, S.Z., Liu, F., Zhao, Z.X., and Ye, Y.F.: Effect of Zr addition on the microstructure and properties of Cu–10Cr in situ composites. Mater. Des. 30, 4444 (2009).CrossRefGoogle Scholar
Xia, C.D., Jia, Y.L., Zhang, W., Zhang, K., Dong, Q.Y., Xu, G.Y., and Wang, M.P.: Study of deformation and aging behaviors of a hot rolled–quenched Cu–Cr–Zr–Mg–Si alloy during thermomechanical treatments. Mater. Des. 39, 404 (2012).CrossRefGoogle Scholar
Deng, L.P., Han, K., Hartwig, K.T., Siegrist, T.M., Dong, L.Y., Sun, Z.Y., Yang, X.F., and Liu, Q.: Hardness, electrical resistivity, and modeling of in situ Cu–Nb microcomposites. J. Alloys Compd. 602, 331 (2014).CrossRefGoogle Scholar
Lei, Q., Li, Z., Wang, J., Xie, J.M., Chen, X., Li, S., Gao, Y., and Li, L.: Hot working behavior of a super high strength Cu–Ni–Si alloy. Mater. Des. 51, 1104 (2013).CrossRefGoogle Scholar
Su, J.H., Liu, P., Li, H., Ren, F.Z., and Dong, Q.M.: Phase transformation in Cu–Cr–Zr–Mg alloy. Mater. Lett. 61, 4963 (2007).CrossRefGoogle Scholar
Que, Z.P., Lee, J.H., Jung, H.M., Shin, J.H., Han, S.Z., and Euh, K.J.: Microstructure evolution in Cu–1.54wt% Cr alloy during directional solidification. J. Cryst. Growth 362, 58 (2013).CrossRefGoogle Scholar
Pang, Y., Xia, C.D., Wang, M.P., Li, Z., Xiao, Z., Wei, H.G., Sheng, X.F., Jia, Y.L., and Chen, C.: Effects of Zr and (Ni, Si) additions on properties and microstructure of Cu–Cr alloy. J. Alloys Compd. 582, 786 (2014).CrossRefGoogle Scholar
Watanabe, C., Monzen, R., and Tazaki, K.: Mechanical properties of Cu-Cr system alloys with and without Zr and Ag. J. Mater. Sci. 43, 813 (2008).CrossRefGoogle Scholar
Su, J.H., Dong, Q.M., Liu, P., Li, H.J., and Kang, B.X.: Research on aging precipitation in a Cu–Cr–Zr–Mg alloy. Mater. Sci. Eng., A 392, 422 (2005).CrossRefGoogle Scholar
Nagesha, A., Parameswaran, P., Biswas, A., Sandhya, R., Asraff, A.K., and Mathew, M.D.: Microstructural investigations into the low cycle fatigue deformation of a Cu–Cr–Zr–Ti alloy. Mater. Sci. Eng., A 582, 91 (2013).CrossRefGoogle Scholar
Wang, Y.H., Song, X.P., Sun, Z.B., Zhou, X., and Guo, J.: Effects of Ti addition on microstructures of melt-spun CuCr ribbons. Trans. Nonferrous Met. Soc. China 17, 72 (2007).CrossRefGoogle Scholar
Wei, K.X., Wei, W., Wang, F., Du, Q.B., Alexandrov, I.V., and Hu, J.: Microstructure, mechanical properties and electrical conductivity of industrial Cu–0.5%Cr alloy processed by severe plastic deformation. Mater. Sci. Eng., A 528, 1478 (2011).CrossRefGoogle Scholar
Xia, C.D., Zhang, W., Kang, Z.Y., Jia, Y.L., Wu, Y.F., Zhang, R., Xu, G.Y., and Wang, M.P.: High strength and high electrical conductivity Cu–Cr system alloys manufactured by hot rolling–quenching process and thermomechanical treatments. Mater. Sci. Eng., A 538, 295 (2012).CrossRefGoogle Scholar
Tewary, N.K., Ghosh, S.K., Bera, S., Chakrabarti, D., and Chatterjee, S.: Influence of cold rolling on microstructure, texture and mechanical properties of low carbon high Mn TWIP steel. Mater. Sci. Eng., A 615, 405 (2014).CrossRefGoogle Scholar
Huh, S.H., Kim, H.K., Park, J.W., and Lee, G.H.: Critical cluster size of metallic Cr and Mo nanoclusters. Phys. Rev. B. 62, 2937 (2000).CrossRefGoogle Scholar
Hatakeyama, M., Toyama, T., Yang, J., Nagai, Y., Hasegawa, M., Ohkubo, T., Eldrup, M., and Singh, B.N.: 3D-AP and positron annihilation study of precipitation behavior in Cu–Cr–Zr alloy. J. Nucl. Mater. 386–388, 852 (2009).CrossRefGoogle Scholar
Hoyt, J.J.: On the coarsening of precipitates located on grain boundaries and dislocations. Acta Metall. Mater. 39, 2091 (1991).CrossRefGoogle Scholar
Bailey, J.E. and Hirsch, P.B.: The dislocation distribution, flow stress, and stored energy in cold worked polycrystalline silver. Philos. Mag. 5, 485 (1960).CrossRefGoogle Scholar
Gao, L., Chen, R.S., and Han, E.H.: Effects of rare-earth elements Gd and Y on the solid solution strengthening of Mg alloys. J. Alloys Compd. 481, 379 (2009).CrossRefGoogle Scholar
Sun, B., Li, S., Imai, H., Mimoto, T., Umeda, J., and Kondoh, K.: Fabrication of high-strength Ti materials by in-process solid solution strengthening of oxygen via P/M methods. Mater. Sci. Eng., A 563, 95 (2013).CrossRefGoogle Scholar
Ellis, D.L. and Michal, G.M.: Precipitation strengthened high strength, high conductivity Cu-Cr-Nb alloys produced by chill block melt spinning. NASA Contractor Reports Server. 185144, (1989).Google Scholar
Fleischer, R.L.: Solution hardening by tetragonal distortions: Application to irradiation hardening in F.C.C. crystals. Acta Metall. 10, 835 (1962).CrossRefGoogle Scholar
Qu, L., Wang, E.G., Han, K., Zuo, X.W., Zhang, L., Jia, P., and He, J.C.: Studies of electrical resistivity of an annealed Cu-Fe composite. J. Appl. Phys. 113, 173708 (2013).CrossRefGoogle Scholar