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Electroforming of oxide-nanoparticle-reinforced copper-matrix composite

Published online by Cambridge University Press:  03 February 2015

Satoshi Semboshi ,
Yasuhiro Sakamoto ,
Hiroyuki Inoue ,
Akihiro Iwase  and
Naoya Masahashi
Satoshi Semboshi*
Affiliation:
Kansai Center, Institute for Materials Research, Tohoku University, Sakai, Osaka 599-8531, Japan; and Department of Materials Science, Osaka Prefecture University, Sakai, Osaka 599-8531, Japan
Yasuhiro Sakamoto
Affiliation:
Research Organization for the 21st Century, Osaka Prefecture University, Sakai, Osaka 599-8531, Japan
Hiroyuki Inoue
Affiliation:
Department of Materials Science, Osaka Prefecture University, Sakai, Osaka 599-8531, Japan
Akihiro Iwase
Affiliation:
Department of Materials Science, Osaka Prefecture University, Sakai, Osaka 599-8531, Japan
Naoya Masahashi
Affiliation:
Kansai Center, Institute for Materials Research, Tohoku University, Sakai, Osaka 599-8531, Japan
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

A method based on the electroforming technique has been proposed for the fabrication of nanoparticle-reinforced copper-matrix composites using an electrolyte of copper sulfate–sulfuric acid solution containing 1 cm3/L of the nanoparticles without surfactants. Of the tested nanoparticles such as Al2O3, SiO2, TiO2, ZrO2, and CeO2, whose sizes ranged from 10 to 30 nm, only TiO2 nanoparticles were successfully embedded in the copper matrix during electroforming, owing to their positive charge in the electrolyte solution. It should be noted that there was very little contamination in the copper matrix, because surfactants were absent during electroforming. Therefore, the electrical conductivity of the specimen that was electroformed in the electrolytes with TiO2 nanoparticles was not significantly different from that of pure copper. Nevertheless, the hardness, yield, and ultimate tensile strength were significantly improved by a small amount (0.3 mass%) of TiO2 nanoparticles primarily because of strengthening by Orowan mechanics. The electroforming process is thus a promising means to prepare copper-matrix composites with an excellent balance of electrical conductivity and mechanical strengths.

Keywords

compositeCuelectrochemical synthesis
Type
Articles
Information
Journal of Materials Research , Volume 30 , Issue 4 , 28 February 2015 , pp. 521 - 527
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Nagarjuna, S., Balasubramanian, K., and Sarma, D.S.: On the variation of mechanical properties with solute content in Cu–Ti alloys. Mater. Sci. Eng., A 225, 118 (1999).CrossRefGoogle Scholar
Miyake, J. and Fine, M.E.: Electrical conductivity versus strength in a precipitation hardened alloy. Acta Metall. Mater. 40, 733 (1992).CrossRefGoogle Scholar
Semboshi, S. and Konno, T.J.: Effect of aging in hydrogen atmosphere on electrical conductivity of Cu-3 at.% Ti alloy. J. Mater. Res. 23, 473 (2008).CrossRefGoogle Scholar
Gladman, T.: Precipitation hardening in metals. Mater. Sci. Technol. 15, 30 (1999).CrossRefGoogle Scholar
Zhang, Z. and Chen, D.L.: Consideration of Orowan strengthening effect in particulate-reinforced metal matrix nanocomposites: A model for predicting their yield strength. Scr. Mater. 54, 1321 (2006).CrossRefGoogle Scholar
Viswanathan, V., Laha, T., Balani, K., Agarwal, A., and Seal, S.: Challenges and advances in nanocomposite processing techniques. Mater. Sci. Eng., R 54, 121 (2006).CrossRefGoogle Scholar
Xing, H., Cao, X., Hu, W., Zhao, L., and Zhang, J.: Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting. Mater. Lett. 59, 1563 (2005).CrossRefGoogle Scholar
Ramesh, C.S., Noor Ahmed, R., Mujeebu, M.A., and Abdulah, M.Z.: Development and performance analysis of novel cast copper–SiC–Gr hybrid composites. Mater. Des. 30, 1957 (2009).CrossRefGoogle Scholar
Barmouz, M., Asadi, P., Besharati Givi, M.K., and Taheirishargh, M.: Investigation of mechanical properties of Cu/SiC composite fabricated by FSP: Effect of SiC particles' size and volume fraction. Mater. Sci. Eng., A 528, 1740 (2011).CrossRefGoogle Scholar
Afshar, A. and Simchi, A.: Abnormal grain growth in alumina dispersion-strengthened copper produced by an internal oxidation process. Scr. Mater. 58, 966 (2008).CrossRefGoogle Scholar
Fathy, A., Shehata, F., Abdelhameed, M., and Elmahdy, M.: Compressive and wear resistance of nanometric alumina reinforced copper matrix composites. Mater. Des. 36, 100 (2012).CrossRefGoogle Scholar
Mizuuchi, K., Inoue, K., Agari, Y., Morisada, Y., Sigioka, M., Tanaka, M., Takeuchi, T., Kawahara, M., and Makino, Y.: Processing of diamond particle dispersed aluminium matrix composites in continuous solid-liquid co-existent state by SPS and their thermal properties. Composites, Part B 42, 10 (2011).Google Scholar
Naser, J., Riehemann, W., and Ferkel, H.: Dispersion hardening of metals by nanoscaled ceramic powders. Mater. Sci. Eng., A 234, 467 (1997).CrossRefGoogle Scholar
Mula, S., Sahani, P., Pratihar, S.K., Mal, S., and Koch, C.C.: Mechanical properties and electrical conductivity of Cu–Cr and Cu–Cr–4% SiC nanocomposites for thermo-electric application. Mater. Sci. Eng., A 528, 4348 (2011).CrossRefGoogle Scholar
Chen, E.S., Lakshminarayanan, G.R., and Sautter, F.K.: The codeposition of alumina and titania with copper. Metal. Trans. 2, 937 (1971).CrossRefGoogle Scholar
Buelens, C., Celis, J.P., and Roos, J.R.: Electrochemical aspects of the codeposition of gold and copper with inert particles. J. Appl. Electrochem. 13, 541 (1983).CrossRefGoogle Scholar
Lee, C.C. and Wan, C.C.: A study of the composite electrodeposition of copper with alumina powder. J. Electrochem. Soc. 135, 1930 (1988).CrossRefGoogle Scholar
Musiani, M.: Electrodeposition of composites: An expanding subject in electrochemical materials science. Electrochim. Acta 45, 3397 (2000).CrossRefGoogle Scholar
Zhu, J., Liu, L., Hu, G., Shen, B., Hu, W., and Ding, W.: Study on composite electroforming of Cu/SiCp composites. Mater. Lett. 58, 1634 (2004).CrossRefGoogle Scholar
Verelst, M., Bonino, J.P., and Rousset, A.: Electroforming of metal matrix composite: Dispersoid grain size dependence of thermostructural and mechanical properties. Mater. Sci. Eng., A 135, 51 (1991).CrossRefGoogle Scholar
Zhu, J.H., Liu, H.Z., Liu, L., Zhao, H.J., Shen, B., and Hu, W.B.: Preparation and characterization of electroformed Cu/nano Al2O3 composite. Mater. Sci. Technol. 23, 665 (2007).CrossRefGoogle Scholar
Ramalingam, S., Muralidharan, V.S., and Subramania, A.: Electrodeposition and characterization of Cu–TiO2 nanocomposite coatings. J. Solid State Electrochem. 13, 1777 (2009).CrossRefGoogle Scholar
Mangam, V., Das, K., and Das, S.: Structure and properties of electrocodeposited Cu–CeO2 nanocomposite thin film. Mater. Chem. Phys. 120, 631 (2010).CrossRefGoogle Scholar
Robin, A., Santana, J.C.P., and Sartori, A.F.: Characterization of copper–silicon nitride composite electrocoatings. J. Appl. Electrochem. 40, 507 (2010).CrossRefGoogle Scholar
Zhao, H., Liu, L., Wu, Y., and Hu, W.: Investigation on wear and corrosion behavior of Cu–graphite composites prepared by electroforming. Compos. Sci. Technol. 67, 1210 (2007).CrossRefGoogle Scholar
Ibanez, A. and Fatas, E.: Mechanical and structural properties of electrodeposited copper and their relation with the electrodeposition parameter. Surf. Coat. Technol. 191, 7 (2005).CrossRefGoogle Scholar
Winand, R.: Electrodeposition of metals and alloys—New results and perspectives. Electrochim. Acta 39, 1091 (1994).CrossRefGoogle Scholar
Cziraki, A., Gerocs, I., Toth-Kadar, E., and Bakonyi, I.: TEM and XRD study of the microstructure of nanocrystalline Ni and Cu prepared by severe plastic deformation and electrodeposition. Nanostruct. Mater. 6, 547 (1995).CrossRefGoogle Scholar
Hakamada, M., Nakamoto, Y., Matsumoto, H., Iwasaki, H., Chen, Y., Kusuda, H., and Mabuchi, M.: Relationship between hardness and grain size in electrodeposited copper films. Mater. Sci. Eng., A 457, 120 (2007).CrossRefGoogle Scholar
Mattson, T., Sedin, M., and Theliander, H.: Zeta-potential and local filtration properties: Constitutive relationships for TiO2 from experimental filtration measurements. Chem. Eng. Sci. 66, 4573 (2011).CrossRefGoogle Scholar
Velikovska, P. and Mikulasek, P.: The influence of Cl−, SO42− and PO43− ions on the ζ-potential and microfiltration of titanium dioxide dispersions. Sep. Purif. Technol. 58, 295 (2007).CrossRefGoogle Scholar
Simunkova, H., Pessenda-Garcia, P., Wosik, J., Angerer, P., Kronberger, H., and Nauer, G.E.: The fundamentals of nano- and submicro-scaled ceramic particles incorporation into electrodeposited nickel layer: Zeta potential measurements. Surf. Coat. Technol. 203, 1806 (2009).CrossRefGoogle Scholar
Pomoni, K., Safianou, M.V., Georgakopoulos, T., Boukos, N., and Trapalis, C.: Electrical conductivity studies of anatase TiO2 with dominant highly reactive {001} facets. J. Alloys Compd. 548, 194 (2013).CrossRefGoogle Scholar
Semboshi, S., Nishida, T., and Numakura, H.: Microstructure and mechanical properties of Cu–3 at.% Ti alloy aged in a hydrogen atmosphere. Mater. Sci. Eng., A 517, 105 (2009).CrossRefGoogle Scholar
Borgese, I., Gelfi, M., Bontempi, E., Goudeau, P., Geandier, G., Thiaudiere, D., and Depero, L.E.: Young modulus and Poisson ratio measurements of TiO2 thin film deposited with atomic layer deposition. Surf. Coat. Technol. 206, 2459 (2012).CrossRefGoogle Scholar