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Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

Published online by Cambridge University Press:  31 January 2011

Jenn-Ming Song ,
Chien-Wei Su ,
Yi-Shao Lai  and
Ying-Ta Chiu
Chien-Wei Su
Affiliation:
Department of Materials Science and Engineering, National Dong Hwa University, Hailien 974, Taiwan
Ying-Ta Chiu
Affiliation:
Central Labs, Advanced Semiconductor Engineering, Inc., Kaohsiung 811, Taiwan
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Abstract

Using nanoindentation, this study develops the criteria to evaluate the creep performance of the intermetallic compounds (IMCs) formed at the interface of microelectronic solder joints. Regardless of crystal structure and melting point, the creep stress exponent (X), one of the parameters determining creep resistance, is in good agreement with tendencies of the work-hardening exponent (n) and also the ratio of yield stress (Y) to Young's modulus (E), which reveals the ability against plastic deformation.

Keywords

SolderingNanoindentationCompound
Type
Materials Communications
Information
Journal of Materials Research , Volume 25 , Issue 4 , April 2010 , pp. 629 - 632
Copyright
Copyright © Materials Research Society 2010

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