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In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect

Published online by Cambridge University Press:  31 January 2011

Yung-Yu Hsu ,
Mario Gonzalez ,
Frederick Bossuyt ,
Fabrice Axisa ,
Jan Vanfleteren  and
Ingrid De Wolf
Yung-Yu Hsu*
Affiliation:
IMEC, Kapeldreef 75, 3001, Leuven, Belgium; and Department of Materials Engineering, K.U. Leuven, Belgium
Mario Gonzalez
Affiliation:
IMEC, Kapeldreef 75, 3001, Leuven, Belgium
Jan Vanfleteren
Affiliation:
IMEC-Centre for Microsystems Technology, Gent-Zwijnaarde, Belgium
Ingrid De Wolf
Affiliation:
IMEC, Kapeldreef 75, 3001, Leuven, Belgium; and Department of Materials Engineering, K.U. Leuven, Belgium
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

Electronic devices capable of performing in extreme mechanical conditions such as stretching, bending, or twisting will improve biomedical and wearable systems. The required capabilities cannot be achieved with conventional building geometries, because of structural rigidity and lack of mechanical stretchability. In this article, a zigzag-patterned structure representing a stretchable interconnect is presented as a promising type of building block. In situ experimental observations on the deformed interconnect are correlated with numerical analysis, providing an understanding of the deformation and failure mechanisms. The experimental results demonstrate that the zigzag-patterned interconnect enables stretchability up to 60% without rupture. This stretchability is accommodated by in-plane rotation of arms and out-of-plane deformation of crests. Numerical analysis shows that the dominating failure cause is interfacial in-plane shear stress. The plastic strain concentration at the arms close to the crests, obtained by numerical simulation, agrees well with the failure location observed in the experiment.

Keywords

DevicesElectronic structureMicroelectronics
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 12 , December 2009 , pp. 3573 - 3582
Copyright
Copyright © Materials Research Society 2009

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