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Damage behavior of Cu–Ta bilayered films under cyclic loading

Published online by Cambridge University Press:  31 January 2011

X.F. Zhu ,
G.P. Zhang ,
J. Tan ,
Y. Liu  and
S.J. Zhu
X.F. Zhu
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
G.P. Zhang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
J. Tan
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
Y. Liu
Affiliation:
Nanometrics Inc., Milpitas, California 95035
S.J. Zhu
Affiliation:
Department of Intelligent Mechanical Engineering, Fukuoka Institute of Technology, Higashi-ku, Fukuoka, 811-0295, Japan
*
a)Address all correspondence to this author.e-mail: [email protected]
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Abstract

Damage behavior of Cu–Ta bilayered films bonded to polyimide (PI) substrates has been investigated by cyclic loading tests. Experimental results show that fatigue cracks preferentially initiated in the Ta layer close to the Ta–PI interface and propagated into the Cu layer perpendicular to the interface. The alignment of nanometer-sized Cu grains resulted from the potential GB sliding combined with a small amount of grain rotation was found in the damage zone ahead of the crack tip, and that is suggested to be a likely damage mechanism to accommodate cyclic plastic strain ahead of the fatigue crack tip of the submicrometer-thick Cu layer.

Keywords

FatigueLayeredNanoscale
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 9 , September 2007 , pp. 2478 - 2482
Copyright
Copyright © Materials Research Society 2007

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References

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