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Characteristics of tin whiskers formed on sputter-deposited films—an aging study

Published online by Cambridge University Press:  03 March 2011

J.P. Winterstein
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
J.B. LeBret
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
M.G. Norton
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
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Abstract

Tin whiskers formed on sputter-deposited films on Muntz metal substrates have been examined following long-term aging at room temperature. It was found that while the initial annealing conditions determined the original nucleation and growth rates, whisker nucleation and growth was a continuous process and appeared to be occurring throughout the duration of the study. Whisker densities increased for all samples during aging, and samples that initially showed no whiskers during high-temperature annealing had a population density of 2.5 mm−2 after storage for 15 months.

Type
Rapid Communications
Copyright
Copyright © Materials Research Society 2004

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References

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