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Assessing texture development and mechanical response in microscale reverse extrusion of copper

Published online by Cambridge University Press:  15 February 2018

Bin Zhang
Affiliation:
Mechanical & Industrial Engineering Department, Louisiana State University, Baton Rouge, Louisiana 70803, USA
Yooseob Song
Affiliation:
Civil and Environmental Engineering Department, Louisiana State University, Baton Rouge, Louisiana 70803, USA
George Z. Voyiadjis
Affiliation:
Civil and Environmental Engineering Department, Louisiana State University, Baton Rouge, Louisiana 70803, USA
Wen Jin Meng*
Affiliation:
Mechanical & Industrial Engineering Department, Louisiana State University, Baton Rouge, Louisiana 70803, USA
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Axisymmetric reverse extrusion experiments were conducted on annealed Cu rod specimens to form cup-shaped structures with sidewall thicknesses ranging from ∼400 µm down to ∼25 µm. Changes in Cu grain morphology, size, and texture were examined through scanning electron microscopy and electron backscatter diffraction (EBSD). Pole figure and orientation distribution function analysis of EBSD data showed the same texture components in the present small-scale metal forming experiments as those observed in macroscale sheet metal rolling. The plastic deformation became inhomogeneous as the characteristic dimension for extrusion decreased to ∼25 µm, such that the deformation process involved a small number of Cu grains. Extrusion force–punch displacement curves were measured as a function of extruded cup sidewall thickness and compared to outputs of a continuum plasticity finite element analysis in corresponding geometries. The present work illustrates materials characteristics in small-scale metal forming and suggests directions of future work for bringing improved correspondence between experimentation and modeling.

Type
Article
Copyright
Copyright © Materials Research Society 2018 

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Footnotes

Contributing Editor: Jürgen Eckert

References

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