Skip to main content Accessibility help
×
Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-23T19:22:44.571Z Has data issue: false hasContentIssue false

7 - Materials for substrates

Published online by Cambridge University Press:  05 October 2014

Luca Roselli
Affiliation:
Università degli Studi di Perugia, Italy
Get access

Summary

Introduction

Selecting proper materials for substrates depending on applications is one of the most important design steps in the field of microwave designs because substrate material determines relative dielectric constant (εr), loss (tan δ), and flexibility. The impedance of transmission lines such as microstrip lines and co-planar waveguides (CPW) is a function of the relative dielectric constant (εr) and thickness of the substrate as well as its physical dimensions. Therefore, the dimensions of transmission lines, like width of conductors or gap, are decided by the substrate material. For compact system integration, a substrate which has high relative dielectric constant (εr) is preferable since it increases capacitances of the overall microwave circuit components, resulting in small feature sizes and low radiation losses. Otherwise, a material with low relative dielectric constant (εr) is a good substrate for structures for radiation like antennas or RFIDs. The thickness of the substrate is also an important design parameter. It is directly related to effective relative dielectric constant (εeff), which has effects on resonance frequency as well as on feature sizes of the structures on the substrate. It is obvious that the resonance frequencies or poles of RF components like antennas or filters change depending on effective relative dielectric constant (εeff), which is a function of substrate thickness. In addition, directivity of antennas is affected by the thickness of the substrate because the radiated wave tends to propagate to a material with high dielectric constant (εr), which results in an uneven radiation pattern as the substrate thickness increases. The loss of the substrate should be considered when the substrate is chosen too. The loss of the substrate may limit microwave circuit designs since some designs are not compatible with high loss substrates like a cavity filler or an antenna which has high-Q factor. The loss of the substrate can be reduced by utilizing a thin substrate but sometimes it may also be acting as a fabrication limitation for stability of fabrication reasons. For flexibility, the thickness and the natural properties of the substrate material are critical. Flexible substrates are preferred for use in certain applications, such as biomedical. The material and the thickness should be carefully chosen based on application requirements.

Type
Chapter
Information
Green RFID Systems , pp. 176 - 194
Publisher: Cambridge University Press
Print publication year: 2014

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Heinola, J.-M. and Tolsa, K., “Dielectric characterization of printed wiring board materials using ring resonator techniques: a comparison of calculation models,” IEEE Trans. Dielectr. Electr. Insul., 13, (4), 717–726, (Aug.) 2006.CrossRefGoogle Scholar
Yang, L., Rida, A., Vyas, R., and Tentzeris, M. M., “RFID tag and RF structures on a paper substrate using inkjet-printing technology,” IEEE Trans. Microw. Theory Techn., 55, 2894–2901, (Dec.) 2007.CrossRefGoogle Scholar
Latti, K. P., Kettunen, M., Stoem, J. P., and Silventoinen, P., “A review of microstrip T-resonator method in determining the dielectric properties of printed circuit board materials,” IEEE Trans. Ins. Mea., 56, 1845–1850, (Oct.) 2007.CrossRefGoogle Scholar
Fulford, A. R. and Wentworth, S. M., “Conductor and dielectric-property extraction using microstrip tee resonators,” Microw. Opt. Techn. Let., 47, 14–16, (Oct.) 2005.CrossRefGoogle Scholar
Thompson, D. C., Tantot, O., Jallageas, H., et al., “Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 GHz,” IEEE Trans. Microwave Theory Tech., 52, (4), 1343–1352, 2004.CrossRefGoogle Scholar
Kirschning, M. and Jansen, R. H., “Accurate model for effective dielectric constant with validity up to millimeter-wave frequencies,” Electron. Lett., 18, 272–273, (Jan.) 1982.CrossRefGoogle Scholar
Pucel, R. A., Masse, D. J., and Hartwig, C. P., “Losses in microstrip,” IEEE Trans. Microw. Theory Techn., 16, (6), 342–350, 1968.CrossRefGoogle Scholar
Devlin, L., Pearson, G., and Pittock, J., “RF and microwave component development in LTCC,” in IMAPS Nordic 38th Annu. Conf., pp. 96–110, Sep. 2001.
Wei, Z. and Pham, A., “Liquid crystal polymer for microwave/millimeter wave multi-layer packaging,” in IEEE MTT-S Dig., 3, 2273–2276, (Jun.) 2003.Google Scholar
[Online] Available: .
Cook, B. S. and Shamim, A., “Inkjet printing of novel wideband and high gain antennas on low-cost paper substrate,” IEEE Trans. Antennas Propag., 50, (9), 4148–4156, (Aug.) 2012.CrossRefGoogle Scholar
Karnfelt, C., Tegnander, C., Rudnicki, J., Starski, J. P., and Emrich, A., “Investigation of arylene-C on the performance of millimeter-wave circuits,” IEEE Trans. Microwave Theory Tech., 54, (8), 3417–3425, 2006.CrossRefGoogle Scholar
Specialty Coating Systems Co. (SCS). Indianapolis, IN, .
Sharifi, H., Lahiji, R. R., Han-Chung, L., et al., “Characterization of parylene-N as flexible substrate and passivation layer for microwave and millimeter-wave integrated circuits,” IEEE Trans. Adv. Pack., 32, (1), 84–92, (Feb.) 2009.CrossRefGoogle Scholar
[Online] Available: .
[Online] Available: .
Hartshorn, L. and Rushton, E., “The dielectric properties of cellulose acetate,” Journal of the Institution of Electrical Engineers, 81, (501), 315–332, (Sep.) 1938.CrossRefGoogle Scholar
Nakagawa, T., Nakiri, T., Hosoya, R., and Tajitsu, Y., “Electrical properties of biodegradable polylactic acid film,” IEEE Trans. Ind. Appl., 40, (4), 1020–1024, (July/Aug.) 2004.CrossRefGoogle Scholar
Petrovic, Z. S., Milic, J., Xu, Y., and Cvetkovic, I., “A chemical route to high molecular weight vegetable oil-based polyhydroxyalkanoate,” Macromolecules, 43, (9), 4120–4125, (May) 2010.CrossRefGoogle Scholar
Microfab Technologies, (2010), available: .
Sridhar, A., “An inkjet printing-based process chain for conductive structures on printed circuit board materials,” PhD, EE, University of Twente, Enshede, 2010.
Edwards, T. C., Foundations for Microstrip Circuit Design, Wiley, 1981.Google Scholar
Hoffmann, R. K., Handbook of Microwave Integrated Circuits, translation from the German of Integrierte Mikrowellenschaltungen, Artech House, 1987.Google Scholar
Kompa, G. and Mehran, R., “Planar waveguide model for calculating microstrip components,” Electron. Lett., 11, 459–460, 1975.CrossRefGoogle Scholar
Alimenti, F., Mezzanotte, P., Dionigi, M., Virili, M., and Roselli, L., “Microwave circuits in paper substrates exploiting conductive adhesive tapes,” IEEE Microwave Wireless Components Letters, 22, (12), 660–662, 2012.

Save book to Kindle

To save this book to your Kindle, first ensure [email protected] is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about saving to your Kindle.

Note you can select to save to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be saved to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Available formats
×

Save book to Dropbox

To save content items to your account, please confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your account. Find out more about saving content to Dropbox.

Available formats
×

Save book to Google Drive

To save content items to your account, please confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your account. Find out more about saving content to Google Drive.

Available formats
×