Book contents
- Electromigration in Metals
- Electromigration in Metals
- Copyright page
- Dedication
- Contents
- Preface
- 1 Introduction to Electromigration
- 2 Fundamentals of Electromigration
- 3 Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects
- 4 Stress Evolution and Damage Formation in Confined Metal Lines under Electric Stressing
- 5 Electromigration in Cu Interconnect Structures
- 6 Scaling Effects on Microstructure of Cu and Co Nanointerconnects
- 7 Analysis of Electromigration-Induced Stress Evolution and Voiding in Cu Damascene Lines with Microstructure
- 8 Massive-Scale Statistical Studies for Electromigration
- 9 Assessment of Electromigration Damage in Large On-Chip Power Grids
- Index
- References
1 - Introduction to Electromigration
Published online by Cambridge University Press: 05 May 2022
Book contents
- Electromigration in Metals
- Electromigration in Metals
- Copyright page
- Dedication
- Contents
- Preface
- 1 Introduction to Electromigration
- 2 Fundamentals of Electromigration
- 3 Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects
- 4 Stress Evolution and Damage Formation in Confined Metal Lines under Electric Stressing
- 5 Electromigration in Cu Interconnect Structures
- 6 Scaling Effects on Microstructure of Cu and Co Nanointerconnects
- 7 Analysis of Electromigration-Induced Stress Evolution and Voiding in Cu Damascene Lines with Microstructure
- 8 Massive-Scale Statistical Studies for Electromigration
- 9 Assessment of Electromigration Damage in Large On-Chip Power Grids
- Index
- References
Summary
This chapter provides an overview of electromigration in metals, starting from the early studies on bulk metals to the current studies on copper interconnects. Asmicroelectronics technology advances, electromigration becomes an important reliability problem for on-chip interconnects, evolving from the microscale to the nanoscale in copper lines. Key concepts are introduced, including the electron wind force, the Blech short-length effects, and copper damascene interconnects.
- Type
- Chapter
- Information
- Electromigration in MetalsFundamentals to Nano-Interconnects, pp. 1 - 7Publisher: Cambridge University PressPrint publication year: 2022
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