A flexible and adaptive energy-efficient high-speed wireless hub is developed in polymer foil as a Hybrid System-in-Foil (HySiF) using Chip-Film Patch (CFP) technology. In this matter, the SiGe BiCMOS silicon chips (2.39 × 1.65 mm2) are thinned down to 45 μm and are embedded face-up inside a two-polymer CFP carrier. The active pads of the embedded silicon chips inside foil are extended to the surface of the foil to interconnect to the antenna on the foil. The integrated hybrid system has a signal transmission at 5–6 GHz frequency band. The overall thickness of the system is below 100 μm and its bendability is down to 4 mm radius of curvature. The designed and fabricated PA silicon chips operate at 50 mA with a 1.5 V supply voltage. Therefore, in addition to the high lateral thermal resistance of the thinned chip, self-heating loop inside polymer due to the low thermal conductivity of the embedding polymer raises the system temperature. Consequently, the thermal behavior and RF performance of the PA chip under different conditions are investigated. Moreover, the antenna with the required carrier frequency is simulated, fabricated, and measured on top of the polymer foil as a stand-alone system in the flexible CFP.