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Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress
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- Journal:
- Journal of Materials Research / Volume 34 / Issue 16 / 28 August 2019
- Published online by Cambridge University Press:
- 16 July 2019, pp. 2775-2788
- Print publication:
- 28 August 2019
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- Article
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