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Automation of In-trench TEM Lamella Workflow Increasing Throughput for Lift-out
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- Journal:
- Microscopy and Microanalysis / Volume 26 / Issue S2 / August 2020
- Published online by Cambridge University Press:
- 30 July 2020, pp. 1980-1981
- Print publication:
- August 2020
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Xe plasma FIB Delayering of IC based on 14 nm node technology
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- Journal:
- Microscopy and Microanalysis / Volume 22 / Issue S3 / July 2016
- Published online by Cambridge University Press:
- 25 July 2016, pp. 56-57
- Print publication:
- July 2016
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