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Automation of In-trench TEM Lamella Workflow Increasing Throughput for Lift-out

Published online by Cambridge University Press:  30 July 2020

Marek Šikula ,
Lukáš Hladík ,
Jozef Oboňa  and
Rostislav Váňa
Marek Šikula
Affiliation:
TESCAN Brno, s.r.o., Brno, Jihomoravsky kraj, Czech Republic
Lukáš Hladík
Affiliation:
TESCAN ORSAY HOLDING, a.s., Brno, Jihomoravsky kraj, Czech Republic
Jozef Oboňa
Affiliation:
TESCAN ORSAY HOLDING, a.s., Brno, Jihomoravsky kraj, Czech Republic
Rostislav Váňa
Affiliation:
TESCAN Brno, s.r.o., Brno, Jihomoravsky kraj, Czech Republic

Abstract

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Type
Vendor Symposium - Materials Preparation
Information
Microscopy and Microanalysis , Volume 26 , Supplement S2 , August 2020 , pp. 1980 - 1981
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Copyright
Copyright © Microscopy Society of America 2020

References

Yuzhe, Z. et al. , “Advanced ex-situ TEM sample preparation for full metal process samples”, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (2017), p. 1-3.Google Scholar
Hrnčíř, T. et al. , “Variable Angle TEM Grid Holder for Advanced TEM Lamellae Preparation”, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis (2019), p. 219-222.Google Scholar