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Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation – CORRIGENDUM

Published online by Cambridge University Press:  11 March 2013

Pylin Sarobol ,
Wei-Hsun Chen ,
Aaron E. Pedigo ,
Peng Su ,
John E. Blendell  and
Carol A. Handwerker

Abstract

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Type
Corrigendum
Information
Journal of Materials Research , Volume 28 , Issue 5 , 14 March 2013 , pp. 785
Copyright
Copyright © Materials Research Society 2013

doi: 10.1557/jmr.2012.430, Published by Cambridge University Press, 17 January 2013.

In Sarobol et al.,1 Fig. 1 is missing the following permission line:

© 2013 IEEE. Reprinted, with permission, from P. Sarobol, A.E. Pedigo, P. Su, J.E. Blendell, and C.A. Handwerker: Defect morphology and texture in Sn, Sn–Cu, and Sn–Cu–Pb electroplated films. IEEE Trans. Electron. Packag. Manuf. 33, 159–164 (2010).

The authors regret the mistake.

References

REFERENCE

Sarobol, Pylin, Chen, Wei-Hsun, Pedigo, Aaron E., Su, Peng, Blendell, John E., and Handwerker, Carol A.: Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation. J. Mater. Res. (2013).Google Scholar