Hostname: page-component-78c5997874-mlc7c Total loading time: 0 Render date: 2024-11-02T22:04:41.585Z Has data issue: false hasContentIssue false
  • English
  • Français

X-RAY Determination and Analysis of Residual Stresses in Uniform Films and Patterned Lines of Tungsten

Published online by Cambridge University Press:  21 February 2011

L Maniguet ,
M. Ignat ,
M. Dupeux ,
J.J. Bacmann  and
Ph. Normandon
L Maniguet
Affiliation:
Laboratoire de Thbermodynamique et Physico-Chimie MWtallurgiques, ENSEEG, BP75 38402 St Martin d'Hères -, France
M. Ignat
Affiliation:
Laboratoire de Thbermodynamique et Physico-Chimie MWtallurgiques, ENSEEG, BP75 38402 St Martin d'Hères -, France
M. Dupeux
Affiliation:
Laboratoire de Thbermodynamique et Physico-Chimie MWtallurgiques, ENSEEG, BP75 38402 St Martin d'Hères -, France
J.J. Bacmann
Affiliation:
CEA/CEREMA/DEM/SGS, CENG 85X 38401 Grenoble -, France
Ph. Normandon
Affiliation:
FRANCE TELECOM - CNET, BP.98, 38243 Meylan -, France
Get access

Abstract

The determination by X-ray diffraction of the elastic strain tensors and the corresponding stress tensors in uniform films and patterned lines of tungsten was used to investigate the effect of line width. The stresses were found to increase with increasing line width. These experimental results are discussed with respect to the values obtained from a model using a distributed force in the line. The results of the calculations are in agreement with the X-ray measurements. The edge effects appear to be significant for tungsten lines.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 217
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] James, M. R. and Cohen, J. B., “The Measurement of Residual Stresses by X-ray Diffraction Techniques”, in Treatise on Materials Science and Technology, Vol. 19A, Herman, H., ed., Academic Press, New York, 1980, pp. 1–62.Google Scholar
[2] Castex, L., Sprauel, J. M., Revue Française de Mécanique, Vol. 2, pp. 103, 1987.Google Scholar
[3] Gergaud, P., “Analyse m6canigue et microstructurale de d6pts de molybdene et de molybéne carbone é1aborés par pulvyrisation cathodigue magadtron” Thèse, ENSAM, Paris, 1992.Google Scholar
[4] , Swanson, Tatge, Natl. Bur. Stand. (U.S.), Circ. 539, 1 28, 1953.Google Scholar
[5] Flinn, P. A. and Chiang, C., “X-ray determination of the effect of various passivations on stress in metal films and patterned lines”, J. Appl. Phys., Vol.67, 1990, pp. 2927–2931.CrossRefGoogle Scholar
[6] Flinn, P. A., “Stress in Passivated Films”, Thin Films: Stress and Mechanical Propcna.II. MRS Symposium Proceedings Vol.188, Mat. Res. Soc., 1990, pp. 3–13.Google Scholar
[7] Sauter, A. I., “Modeling of thermal stresses and void growth processes in m icroeleoniic interconnect structures”, PH. D. Dissertation, Stanford University, Department of Materials Science and engineering, 1991.Google Scholar
[8] Maniguet, L., Ignat, M., Dupeux, M., Flinn, P. A., Normandon, Ph., Gergaud, P., Bacmann, J.J., “X-ray determination of internal residual stresses in uniform films and patterned tungsten structures”, in Advanced Metalization for UL.I Applications 1992. ed. by Cale, T. S. and Pintchovski, F. S., Mat. Res. Soc. Conf. Proc., 1993, pp. 67–72.Google Scholar