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Work Function Controlled Printed Metal Alloy Pattern Prepared by Using Pressure Annealing Technique

Published online by Cambridge University Press:  04 February 2011

Manabu Yoshida ,
Kouji Suemori ,
Sei Uemura ,
Satoshi Hoshino ,
Noriyuki Takada ,
Takehito Kodzasa  and
Toshihide Kamata
Manabu Yoshida
Affiliation:
Photonics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 3058565 Japan
Kouji Suemori
Affiliation:
Photonics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 3058565 Japan
Sei Uemura
Affiliation:
Photonics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 3058565 Japan
Satoshi Hoshino
Affiliation:
Photonics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 3058565 Japan
Noriyuki Takada
Affiliation:
Photonics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 3058565 Japan
Takehito Kodzasa
Affiliation:
Photonics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 3058565 Japan
Toshihide Kamata
Affiliation:
Photonics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 3058565 Japan
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Abstract

We have developed the pressure annealing technique for fabricating low work function metal pattern on plastic substrate. In general, the difficulty to print conductive low work function metal patterns is caused by the insulating metal oxide layer covering on metal particles included in metal paste. The pressure annealing technique can destruct the metal oxide layer and can form conductive layer on printed metal pattern. Further, we have confirmed that a binary solid solution is easily formed on metal patterns including two kinds of metal particles by using the pressure annealing technique. Changing the composition ratio of the binary metal paste led to the work function control of the pressure-annealed metal patterns. Formation of the binary solid solution was confirmed by using XRD spectra, and work function values were measured by using photoelectron emission spectra. In the case of the binary metal paste of Cu and Zn, we have succeeded in controlling work function from 3.8 eV to 5.0 eV. Since the Cu-Zn paste is composed of relatively low price metals, this would be applicable to large-scale flexible electronic devices.

Keywords

alloymetalsemiconducting
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1288: Symposium G – Novel Fabrication Methods for Electronic Devices , 2011 , mrsf10-1288-g09-07
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

1. Myny, K., Steudel, S., Vicca, P., Beenhakkers, M. J., van Aerle, N.A.J.M., Gelinck, G. H., Genoe, J., Dehaene, W., and Heremans, P.: Solid State Electron., 53, 1220–1226 (2009).Google Scholar
2. Shin, D. -Y., Lee, Y., andKim, C. H.: Thin Solid Films, 517, 6112–6118 (2009).Google Scholar
3. Chao, C.-C., Yang, J.-M., and Jenc, W.-Y.: Technovation, 27, 268–279 (2007).Google Scholar
4. Kunnari, E., Valkama, J., Keskinen, M., and Mansikkamäki, P.: J. Clean. Prod., 17, 791–799 (2009).Google Scholar
5. Mäntysalo, M., and Mansikkamäki, P.: Int. J. Electron. Comm. (AEÜ), 63, 31 – 35 (2009)Google Scholar
6. Liu, Z., Pan, K., Liu, M., Zhang, Q., Li, J., Liu, Y., Lü, Q., Li, J., Wang, D., Bai, Y., and Li, T.: Thin Solid Films, 484, 346– 351 (2005).Google Scholar
7. Gleskova, H., Cheng, I.-C., Wagner, S., and Suo, Z.: Appl. Phys. Lett., 88, 011905 (2006).Google Scholar
8. Yasuda, T., and Tsutsui, T.: Chem. Phys. Lett., 402, 395–398 (2005).Google Scholar
9. Sakanoue, T., Yahiro, M., Adachi, C., Takimiya, K., and Toshimitsu, A.: J. Appl. Phys., 103, 094509 (2008).Google Scholar
10. Chikamatsu, M., Nagamatsu, S., Yoshida, Y., Saito, K., and Yase, K.: Appl. Phys. Lett., 87 203504 (2005).Google Scholar
11. Maaninen, T., “Research and development activities in printed intelligence”, VTT, Finland, 42 (2009).Google Scholar