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Wetting Behaviors of Sn-Based Solders on Cu and Pd Surfaces

Published online by Cambridge University Press:  21 February 2011

H. K. Kim ,
Y. Wang ,
A. Maheshwari  and
K. N. Tu
H. K. Kim
Affiliation:
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095-1595
Y. Wang
Affiliation:
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095-1595
A. Maheshwari
Affiliation:
Miniaturization Lab, Texas Inst. Inc., Temple, TX 76503-6102
K. N. Tu
Affiliation:
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095-1595
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Abstract

We have studied the surface morphology and wetting reaction of eutectic SnBi, eutectic SnPb, and pure Sn on Cu and Pd surfaces. In the case of Pd, the reactions were so fast that no quasi-equilibrium wetting angle could be measured. The compound formation has changed not only the interfaces but also the surfaces. Due to the formation of a reaction band outside the solder cap, the SnPb solder is no longer wetting the Cu surface but rather the Cu-Sn compound surface. In the wetting interface between eutectic SnPb and Cu, the morphology of the scallop-like Cu-Sn compound grains shows that we may not apply the classical model of layered compound growth to analyze the rate of soldering reactions.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 183
Copyright
Copyright © Materials Research Society 1995

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References

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