Hostname: page-component-745bb68f8f-v2bm5 Total loading time: 0 Render date: 2025-01-27T16:03:51.044Z Has data issue: false hasContentIssue false
  • English
  • Français

Vapor Grown Carbon Fiber Reinforced Aluminum Matrix Composites for Enhanced Thermal Conductivity

Published online by Cambridge University Press:  10 February 2011

J.-M. Ting ,
C. Tang  and
P. Lake
J.-M. Ting
Affiliation:
National Cheng Kung University, Tainan, Taiwan, 701, [email protected]
C. Tang
Affiliation:
National Cheng Kung University, Tainan, Taiwan, 701, [email protected]
P. Lake
Affiliation:
Applied Sciences, Incorporated, Cedarville, OH, 45314, USA
Get access

Abstract

Aluminum matrix composites reinforced with high thermal conductivity vapor grown carbon fiber (VGCF) were developed for improved thermal efficiencies in electronic devices. The carbon fiber was heat treated to increase its thermal conductivity. Various aluminum matrix composites were fabricated by the densification of fiber preforms using a pressure casting technique. Uniformity of the density was examined using optical microscopy. A scanning electron microscope equipped with a microprobe was utilized to examine the mechanical integrity of the composite. Mechanical properties, including tension, compression and flexural properties, were measured. While the results of the mechanical property measurements indicate moderate values, the composite exhibited remarkable thermal conductivity that reached 642 W/m.K, three times that of aluminum, at a fiber volume fraction of 36.5%, following closely the rule of mixture.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 551: Symposium JJ – Materials in Space-Science, Technology & Exploration , 1998 , 281
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Markstein, W., Electron. Pkg. and Prod., p.40, Oct. 1991.Google Scholar
2 Hagge, J.K., IEEE Trans. on Component, Hybrids, and Manufacturing Technologies, 12 [2] 170 (1989).Google Scholar
3 Rossi, R.D., Hybrid Circuit Technology, p.35, Sep., 1989.Google Scholar
4 Licari, J.J., Electron. Pkg. and Prod., p.58, Sep., 1989.Google Scholar
5 Kokado, M., Yoshida, M., Miyoshi, N., Suzuki, K., Takaika, M., Tsuzuki, N., and Harada, H., IEEE J. of Solid State Circuits, 24 [5] 1271 (1989).Google Scholar
6 Goyal, A., Jaeger, R.C., Bhavnani, S.H., Ellis, C.D., Phadke, N.K., Azimi-Rashti, M., and Gooding, J.S., p.25, Proc. Semi-Therm 1992, Austin, TX, February, 1992.Google Scholar
7 Kuhlman, T. M.A. and Sehitoglu, H., pp. 110–8 in Proc. of Semi-Therm 1992, Austin, TX, February 1992.Google Scholar
8 Ting, J.-M., “Processing-Microstucture-Tensile Property of Vapor Grown Carbon Fiber Reinforced Carbon Composite,” p. 316, Proc. MRS Spring Meeting, San Francisco, CA (1995).Google Scholar
9 Mortensen, A., Masur, L.J., Cornie, J.A., and Flemings, M.C., Metall. Trans. 20A, 2549 (1989).Google Scholar
10 Ting, J.-M. and Lake, M.L., Carbon, 33 [5] 663 (1995).Google Scholar