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Trends in Microelectronic Systems Integration: From System on a Chip to System in a Package

Published online by Cambridge University Press:  17 March 2011

Robert H. Reuss ,
Babu R. Chalamala ,
Simon Thomas ,
Marc Chason ,
Daniel Gamota  and
Janice Danvir
Robert H. Reuss
Affiliation:
Motorola, Inc., Semiconductor Products Sector, Digital DNA Laboratory 2100 E. Elliot Road, Tempe, AZ 85284, USA
Babu R. Chalamala
Affiliation:
Motorola, Inc., Semiconductor Products Sector, Digital DNA Laboratory 2100 E. Elliot Road, Tempe, AZ 85284, USA
Simon Thomas
Affiliation:
Motorola, Inc., Semiconductor Products Sector, Digital DNA Laboratory 2100 E. Elliot Road, Tempe, AZ 85284, USA
Marc Chason
Affiliation:
Motorola, Inc., Motorola Laboratories, Advanced Technology Center 1301 E. Algonquin Road, Schaumburg, IL 60196, USA
Daniel Gamota
Affiliation:
Motorola, Inc., Motorola Laboratories, Advanced Technology Center 1301 E. Algonquin Road, Schaumburg, IL 60196, USA
Janice Danvir
Affiliation:
Motorola, Inc., Motorola Laboratories, Advanced Technology Center 1301 E. Algonquin Road, Schaumburg, IL 60196, USA
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Abstract

The continued shift towards the integration of diverse functions into single chips and chip assemblies requires a new vision in microelectronic systems integration. Over the last decade or so, there has been a tremendous push towards systems on chip (SoC) approach for increased functionality. While systems on a chip has received much deserved credit for the size and cost reduction of many products, a true system on a chip solution has not been practical for a number of applications. In some cases, this is simply an issue of chip size, in others material compatibility (Si and GaAs), in yet others electrical compatibility (high voltage, RF, analog, with digital) and in some others the overall cost of integration on silicon, even if technically feasible. The need to combine diverse materials and technologies to achieve increased functionality with decreased size and weight, along with the ever present pressure for lower cost, has created the opportunity for new system level integration opportunities. Among the new concepts, system in a package (SiP) and system on a substrate (SoS) have received the most attention. System in a package is a natural extension of system on a chip concept. Currently, there are aggressive programs to develop SiP capabilities to allow rapid, cost effective design and fabrication of subsystem level packages. System on a substrate is an emerging concept based on the integration of technologies in a wide area of electronics. SoS will take the next step to the full system level (e.g. a monolithic radio). However, there is another important concept that seeks the same objective of system-level integration, but with a different set of drivers. In situations where the product is required to be a certain size (e.g. a display or a smart card), further size reductions of the components is no longer productive. This creates the opportunity for alternative technologies such as thin film transistors and plastic substrates. Integration of these technologies offers the potential for significant cost savings because of lower manufacturing costs, and light weight, wearable, flexible products by elimination of today's rigid substrates. Such technologies not only offer new capabilities, but also change the basic premise of the electronics industry. We could move from the microelectronics to the macroelectronics era. In this paper, we will present an overview of this diverse and emerging technology.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 685: Symposium D – Advanced Materials and Devices for Large-Area Electronics , 2001 , D2.2.1
Copyright
Copyright © Materials Research Society 2001

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References

1 For a complete overview of SoC and SiP technology, refer to IC Packaging Update 1999, Bogatin, E., ed., ICE Corp., Scottsdale, AZ, 1999.Google Scholar
2 Kada, M. and Smith, L., Portable Design 6, 46 (2000).Google Scholar
3 Sherman, D., Elect. Eng. Times Magazine, Oct 16, 2000.Google Scholar
4 Truzzi, C. and Lerner, S., Solid State Technol. 43, 115 (2000).Google Scholar
5 Baliga, J., Semicond. Int. 23, 169 (2000)Google Scholar
6 Tummula, R. R. and Madisetti, V. K., IEEE Design and Test of Comp. 16, 48 (1998).Google Scholar
7 Gregus, J. A., Yau, M. Y., Degani, Y., and Tai, K. L., Bell Labs. Tech. J., p116, Jul-Sep 1998 Google Scholar
8 Tummala, R.R., White, G.E., Sundaram, V., and Bhattacharyam, S., Advancing Microelectronics 27, 13 (2000).Google Scholar
9 Amey, D.I., Dirks, M.T., Draudt, R.R., Horowitz, S.J., and Needes, C.R.S., Adv. Packaging 19, 37 (2000).Google Scholar
10 Arbuckle, B., Logan, E., Pedder, D., Solid St. Technol. 43, 84 (2000).Google Scholar
11 Ulrich, R. K., Brown, W. D., and Schaper, L. W., IEEE Circuits and Dev. Mag. 16, 17 (2000).Google Scholar
12 Oh, C.-H. and Matsumura, M., IEEE Elect. Dev. Lett. 22, 20 (2001).Google Scholar
13 Clark, M. G., IEE Proc. Circuits, Dev. Syst. 141, 3 (1994).Google Scholar
14 For a look at the history and evolution of TFTs for LCDs, refer to Sharp Corporation's website at www.sharp.co.jp and the links therein.Google Scholar
15 Young, N. D., Harkin, G., Bunn, R. N., McCulloch, D. J., and French, I. D., IEEE Trans. Elect. Dev. 43, 1930 (1996).Google Scholar
16 Kane, M. G. et al, IEEE Elect. Dev. Lett. 21, 534 (2000).Google Scholar
17 Kishore, R., Hotz, C., Naseem, H. A., and Brown, W. D., Electrochem. and Solid St. Lett. 4, G14 (2001)Google Scholar
18 Mikami, Y., Nagae, Y., Mori, Y., Kuwabara, K., Saito, T., Hayama, H., Asada, H., Akimoto, Y., Kobayashi, M., Okazaki, S., Asaka, K., Matsui, H., Nakamura, K. and Kaneko, E., IEEE Trans. Electron Dev. 41, 306 (1994).Google Scholar
19 Pique, A., Chrisey, A.D.B., Fitz-Gerald, J.M., McGill, R.A., Auyeung, R.C.Y., Wu, H.D., Lakeou, S., Nguyen, V., Chung, R. and Duignan, M., J. Mat. Res. 15, 1872 (2000).Google Scholar
20 Hong, C. M. and Wagner, S., IEEE Elect. Dev. Lett. 21, 384 (2000).Google Scholar
21 Gleskova, H., Konenkamp, R., Wagner, S. and Shen, D. S., IEEE Elect. Dev. Lett. 17, 264 (1996).Google Scholar