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Three Dimensional Thermal Effects in MEMS Devices

Published online by Cambridge University Press:  15 March 2011

Edward Van Keuren ,
John Currie ,
Matthew Nelson ,
Makarand Paranjape ,
Thomas Schneider ,
Ryan Smith ,
Pat Treado ,
John Ward  and
Robert White
Edward Van Keuren
Affiliation:
Georgetown University, Dept. of Physics, Washington, DC
John Currie
Affiliation:
Georgetown University, Dept. of Physics, Washington, DC
Matthew Nelson
Affiliation:
ChemIcon, Inc., Pittsburgh, PA
Makarand Paranjape
Affiliation:
Georgetown University, Dept. of Physics, Washington, DC
Thomas Schneider
Affiliation:
Georgetown University, Dept. of Physics, Washington, DC Science Applications International Corporation, McLean, VA.
Ryan Smith
Affiliation:
ChemIcon, Inc., Pittsburgh, PA
Pat Treado
Affiliation:
ChemIcon, Inc., Pittsburgh, PA
John Ward
Affiliation:
Science Applications International Corporation, McLean, VA.
Robert White
Affiliation:
Georgetown University, Dept. of Physics, Washington, DC Science Applications International Corporation, McLean, VA.
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Abstract

A three dimensional thermal imaging system is being developed for measuring temperature profiles in MEMS-biomedical devices. These devices rely on a thermal microablation of the dead-skin layer in order to sample transdermal fluids. This is accomplished using microheaters embedded into a PDMS microchannel device. In order to determine the proper functioning as well as long-term safety of the devices, a temperature profile of the device and the skin in contact with the heaters is needed. The results of simple analytical models are used to optimize a proto- type device. Using a three-dimensional chemical imaging microscope and temperature-depend- ent fluorophores, the temperature profile in a sample can be determined quantitatively as well. We demonstrate the technique on a model sample, and discuss extension to other applications such as thermal imaging in biological systems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 687: Symposium B – Materials Science of Microelectromechanical Systems (MEMS) Devices IV , 2001 , B1.3
Copyright
Copyright © Materials Research Society 2002

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References

1. Currie, J., Paranjape, M., Flockhart, D., Schneider, T., White, R., Long, T., Graver, K., Peck, C. “B-FIT [.proportional]-System: BioFlips Integrable Transdermal MicroSystem” MEMS Alliance Workshop on Modeling Tools, NIST Gaithersburg, MD Oct 2000.Google Scholar
2. DARPA Bioflips Program “BFIT (Biofluidic Integrable Transdermal) Microsystem” Contract # NO1-CO-17014-32Google Scholar
3. Chen, M., “Computer-aided Tomographic Thermography”, in Heat Transfer in Medicine and Biology, Vol. 2, ed. Shitzer, A., Eberhart, R., Plenum Press, New York, 1985, Chap. 26.Google Scholar
4. Bertsch, F., Mattner, J., Stehling, M., Muller-Lisse, U., Peller, M., Loeffler, R., Weber, J., Messmer, K., Wilmanns, W., Issels, R., Reiser, M., Magn. Reson. Imaging 16, 393 (1998).Google Scholar
5. Tacke, J., Speetzen, R., Heschel, I., Hunter, D., Rau, G., Günther, R., Cryobiology 38, 250 (1999).Google Scholar
6. Corle, T., Kino, G., Confocal Scanning Optical Microscopy and Related Imaging Systems, Academic Press, San Diego, 1996.Google Scholar
7. Sandison, D., Piston, D., Williams, R., Webb, W., Appl. Optics 34, 3576 (1995).Google Scholar
8. Kolonder, P., J. Tyson, Appl. Phys. Lett. 40, 782 (1982); P. Kolonder, J. Tyson, Appl. Phys. Lett. 42, 117-9 (1983).Google Scholar
9. Zohar, O., Ikeda, M., Shinagawa, H., Inoue, H., Nakamura, H., Elbaum, D., Alkon, D., Yoshioka, T., Biophys. J. 74, 82 (1998).Google Scholar
10. Barton, D., Proc. 20th Inter. Symp. Testing and Failure Analysis (1994) 87–95.Google Scholar