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Thermoreversible Gels of Polyaniline: Viscoelastic and Electrical Properties

Published online by Cambridge University Press:  10 February 2011

O. T. Ikkala
Affiliation:
Helsinki University of Technology, Department of Engineering Physics and Mathematics, P.O. Box 2200, FIN-02015 HUT, Espoo, Finland [email protected]
T. Vikki
Affiliation:
Helsinki University of Technology, Department of Engineering Physics and Mathematics, P.O. Box 2200, FIN-02015 HUT, Espoo, Finland [email protected]
J. Ruokolainen
Affiliation:
Helsinki University of Technology, Department of Engineering Physics and Mathematics, P.O. Box 2200, FIN-02015 HUT, Espoo, Finland [email protected]
P. Hiekkataipale
Affiliation:
Helsinki University of Technology, Department of Engineering Physics and Mathematics, P.O. Box 2200, FIN-02015 HUT, Espoo, Finland [email protected]
P. Passiniemi
Affiliation:
Neste Oy, P.O. Box 310, FIN-06101, Porvoo, Finland
T. Mäkelä
Affiliation:
VTT Electronics, Microelectronics, P.O. Box 1101, FIN-02044 VTT, Espoo, Finland
H. Isotalo
Affiliation:
VTT Electronics, Microelectronics, P.O. Box 1101, FIN-02044 VTT, Espoo, Finland
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Abstract

We demonstrate that polyaniline (PANI) dissolved in dodecyl benzene sulphonic acid (DBSA) shows thermoreversible gelation. The dissolution has been performed in formic acid which allows particle-free complexes according to optical microscopy. Below the gelation temperature the materials are rubber-elastic in compression experiments, the storage modulus G' does not essentially depend on frequency, and the samples are electronically conductive. Above the gelation temperature, G' indicates flow-like behavior and drastically lower ionic conductivity is observed. These results suggest reversible, i.e. fusible, network formation. The properties are compared with gels consisting of camphor sulphonic acid (CSA) doped PANI dissolved in m-cresol which are poorly thermoreversible.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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