Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-28T04:46:52.414Z Has data issue: false hasContentIssue false

Thermal Properties of Cu-Hf-Ti Metallic Glass Compositions

Published online by Cambridge University Press:  05 March 2013

I. A. Figueroa*
Affiliation:
Instituto de Investigaciones en Materiales, Universidad Nacional Autónoma de México, Cd. Universitaria, Del. Coyoacán, México D.F. C. P. 04510, México.
Get access

Abstract

The glass transition temperature Tg, crystallization temperature Tx, solidus temperature Tm, and liquidus temperature Tl, of a number of ternary Cu-Hf-Ti glassy alloys in the composition range of 51< Cu <67, 5 < Hf < 40 and 5 < Ti <40 (at.%) are reported and discussed. It is found that increasing the Ti:Hf ratio results in a rapid decreasing of Tg and Tx. This behavior is related to the fact that the melting point and cohesive energy for Ti are substantially lower than for Hf. The solidus temperature Tm, remains relatively constant on a wide range of compositions. The liquidus temperatures data suggest a ternary eutectic within the compositional field encompassed by the Cu55Hf20Ti25, Cu59Hf21Ti20, Cu60Hf20Ti20 and Cu55Hf21Ti24 alloys, with a liquidus temperature, Tl, of ∼1170 K; this is supported by the DTA traces, which show a single melting peak. Based on the DTA analysis, the experimentally calculated liquidus projection for the ternary Cu-Hf-Ti alloy system is also reported.

Type
Articles
Copyright
Copyright © Materials Research Society 2013 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Yang, Y. J., Xing, D. W., Shen, J., Sun, J. F., Wei, S. D., He, H. J. and McCartney, D. G., J. Alloys Compd. 415, 106 (2006).CrossRefGoogle Scholar
Inoue, A., Zhang, W., Zhang, T. and Kurosaka, K., Acta Mater. 49, 2645 (2001).CrossRefGoogle Scholar
Figueroa, I. A., Rawal, R., Stewart, P., Carroll, P. A., Davies, H. A., Todd, I. and Jones, H., J. Non-Cryst. Solids 353, 839 (2007).CrossRefGoogle Scholar
Figueroa, I. A., Davies, H. A., Todd, I. and Yamada, K., Adv. Eng. Mater., 9 (2007) 496A CrossRefGoogle Scholar
Inoue, A., Kato, A., Zhang, T., Kim, S.G. and Masumoto, T., Mater. Trans. JIM, 32, 609 (1991).CrossRefGoogle Scholar
Inoue, A., Zhang, T., Nishiyama, N., Ohba, K. and Msumoto, T., Matter. Lett. 19, 131 (1994).CrossRefGoogle Scholar
Inoue, A., Nishiyama, N., Matsuda, T., Mater. Trans. JIM 37, 181 (1996).CrossRefGoogle Scholar
Figueroa, I. A., Betancourt, J. I., Lara, G. and Verduzco, J. A., J. of Non-Cryst. Solids, 329, 3075 (2005).CrossRefGoogle Scholar
Itoi, T. and Inoue, A.. Mater. Trans. JIM 42, 1256 (2000).CrossRefGoogle Scholar
Damonte, L.C., Pasquevich, A.F., Mendoza-Zelis, L.A., Figueroa Vargas, I.A., Davies, H.A. and Todd, I., Phys. B 398, 480 (2007).CrossRefGoogle Scholar
Figueroa, I. A., Davies, H. A. and Todd, I., J. Alloys and Comp. 434435, 164 (2007).CrossRefGoogle Scholar
Arroyave, R., Eagar, T. W. and Kaufman, L., J. of Alloys and Comp. 351, 158 (2003).CrossRefGoogle Scholar
Donald, I. W. and Davies, H. A., Phil. Mag. 42, 277 (1980).CrossRefGoogle Scholar
Figueroa, I A., Baez-Pimiento, S., Plummer, J. D., Novelo-Peralta, O., Davies, H. A. and Todd, I., Acta Metallurgica Sinica, 256, 0409 (2012).Google Scholar
Liu, G. Q., Kou, S. Z., Li, C. Y., Zhao, Y. C. and Suo, H. L., Trans. Nonferrous Met. Soc. China 22, 590 (2012).CrossRefGoogle Scholar
Gong, P., Yao, K. F. and Shao, Y., Journal of Alloys and Compounds 536, 26 (2012).CrossRefGoogle Scholar
Dong, B. S., Zhou, S. X., Li, D. R., Lu, C. W., Guo, F., Ni, X. J. and Lu, Z. C., Prog. Nat. Sci.: Mater. Inter. 21, 164 (2011).CrossRefGoogle Scholar
Long, Z. L., Wei, H. Q., Ding, Y. H., et al. . J Alloys Compd 475, 207 (2009).CrossRefGoogle Scholar
Ji, X. and Pan, Y., Trans. Nonferrous Met. Soc. China 19, 1271 (2009).CrossRefGoogle Scholar
Suryanarayana, C., Seki, I. and Inoue, A., J Non-Cryst Solids 355, 355 (2009).CrossRefGoogle Scholar