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Tailoring of Stress Development in MEMS Packaging Systems

Published online by Cambridge University Press:  11 February 2011

Satyajit S. Walwadkar ,
Junghyun Cho ,
P.W. Farrell  and
Lawrence E. Felton
Satyajit S. Walwadkar
Affiliation:
Dept. of Mechanical Engineering, State University of New York, Binghamton, NY 13902–6000
Junghyun Cho
Affiliation:
Dept. of Mechanical Engineering, State University of New York, Binghamton, NY 13902–6000
P.W. Farrell
Affiliation:
Analog Devices, Micromachined Product Division, 21 Osborn Street, Cambridge, MA 02154
Lawrence E. Felton
Affiliation:
Analog Devices, Micromachined Product Division, 21 Osborn Street, Cambridge, MA 02154
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Abstract

A better understanding of the origin and evolution of the stresses is a crucial step in improving reliability of packaging systems for microelectromechanical systems (MEMS). Given its importance, we examine the stresses developed in hermetically packaged MEMS inertial sensors. For this purpose, an optical surface profilometer is employed to assess the stresses by measuring the curvature of dummy silicon dies (3.5×3.5 mm2) assembled in different types of packages and die attach adhesives. We also explore a temporal evolution of stresses during thermal exposure of the test packages in an effort to emulate actual packaging processes and device operation conditions. The result shows different levels of stresses generated from various adhesives and package types, and also a stress evolution during packaging processes. The mechanical stress data also show a good agreement with MEMS performance data obtained from actual accelerometers. Therefore, the stress data will not only be useful in better understanding performance of MEMS packages, but the testing protocol can also provide a diagnostic tool for very small packaging systems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 741: Symposium J – Nano- and Microelectromechanical Systems (NEMS and MEMS) and Molecular Machines , 2002 , J5.22
Copyright
Copyright © Materials Research Society 2003

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